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Michael J. Sheaffer
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Newtown, PA, US
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last 30 patents
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Patent Grant
High yield clampless wire bonding method
Patent number
5,176,311
Issue date
Jan 5, 1993
Kulicke & Soffa Investments, Inc.
Lee R. Levine
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method of making low profile fine wire interconnections
Patent number
5,111,989
Issue date
May 12, 1992
Kulicke & Soffa Investments, Inc.
William J. Holdgrafer
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR