Michael J. Van Riet

Person

Morgan Hill, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Selecting one or more parameters for inspection of a wafer
- Patent number 9,601,393
- Issue date Mar 21, 2017
- KLA-Tencor Corp.
- Chris Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contour-based array inspection of patterned defects
- Patent number 9,483,819
- Issue date Nov 1, 2016
- KLA-Tencor Corporation
- Chien-Huei Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Systems and methods for preparation of samples for sub-surface defe...
- Patent number 9,318,395
- Issue date Apr 19, 2016
- KLA-Tencor Corporation
- Cecelia Campochiaro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selecting parameters for defect detection methods
- Patent number 9,310,316
- Issue date Apr 12, 2016
- KLA-Tencor Corp.
- Kenong Wu
- G01 - MEASURING TESTING
Information Patent Grant
Determining design coordinates for wafer defects
- Patent number 9,087,367
- Issue date Jul 21, 2015
- KLA-Tencor Corp.
- Ellis Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Contour-based defect detection using an inspection apparatus
- Patent number 8,669,523
- Issue date Mar 11, 2014
- KLA-Tencor Corporation
- Chien-Huei Chen
- G01 - MEASURING TESTING
Information Patent Grant
Scanner performance comparison and matching using design and defect...
- Patent number 8,594,823
- Issue date Nov 26, 2013
- KLA-Tencor Corporation
- Allen Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Computer-implemented methods, carrier media, and systems for creati...
- Patent number 8,135,204
- Issue date Mar 13, 2012
- KLA-Tencor Technologies Corp.
- Chien-Huei (Adam) Chen
- G01 - MEASURING TESTING
Information Patent Grant
Methods and systems for generating information to be used for selec...
- Patent number 8,000,922
- Issue date Aug 16, 2011
- KLA-Tencor Corp.
- Hong Chen
- G01 - MEASURING TESTING
Information Patent Grant
Methods for identifying array areas in dies formed on a wafer and m...
- Patent number 7,925,072
- Issue date Apr 12, 2011
- KLA-Tencor Technologies Corp.
- Chien-Huei (Adam) Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods, defect review tools, and systems for locating a defect in...
- Patent number 7,747,062
- Issue date Jun 29, 2010
- KLA-Tencor Technologies Corp.
- Da Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods and systems for generating an inspection process for an ins...
- Patent number 7,570,797
- Issue date Aug 4, 2009
- KLA-Tencor Technologies Corp.
- David Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Remote live video inspection
- Patent number 7,522,664
- Issue date Apr 21, 2009
- Krishnamurthy Bhaskar
- G01 - MEASURING TESTING
Information Patent Grant
Apparatus and methods for analyzing defects on a sample
- Patent number 7,345,753
- Issue date Mar 18, 2008
- KLA-Tencor Technologies Corporation
- Kris Bhaskar
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
CONTOUR-BASED ARRAY INSPECTION OF PATTERNED DEFECTS
- Publication number 20140212024
- Publication date Jul 31, 2014
- KLA-Tencor Corporation
- Chien-Huei CHEN
- G01 - MEASURING TESTING
Information Patent Application
Selecting Parameters for Defect Detection Methods
- Publication number 20140072203
- Publication date Mar 13, 2014
- KLA-Tencor Corporation
- Kenong Wu
- G01 - MEASURING TESTING
Information Patent Application
SYSTEMS AND METHODS FOR PREPARATION OF SAMPLES FOR SUB-SURFACE DEFE...
- Publication number 20130137193
- Publication date May 30, 2013
- KLA-Tencor Corporation
- Cecelia CAMPOCHIARO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Determining Design Coordinates for Wafer Defects
- Publication number 20130064442
- Publication date Mar 14, 2013
- KLA-Tencor Corporation
- Ellis Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CONTOUR-BASED DEFECT DETECTION USING AN INSPECTION APPARATUS
- Publication number 20120298862
- Publication date Nov 29, 2012
- Chien-Huei CHEN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Selecting One or More Parameters for Inspection of a Wafer
- Publication number 20110320149
- Publication date Dec 29, 2011
- KLA-Tencor Corporation
- Chris Lee
- G01 - MEASURING TESTING
Information Patent Application
Scanner Performance Comparison And Matching Using Design And Defect...
- Publication number 20110172804
- Publication date Jul 14, 2011
- KLA-Tencor Corporation
- Allen Park
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHODS AND SYSTEMS FOR GENERATING INFORMATION TO BE USED FOR SELEC...
- Publication number 20090299681
- Publication date Dec 3, 2009
- Hong Chen
- G01 - MEASURING TESTING

Michael J. Van Riet

Person

Patents Grantslast 30 patents

Selecting one or more parameters for inspection of a wafer

Contour-based array inspection of patterned defects

Systems and methods for preparation of samples for sub-surface defe...

Selecting parameters for defect detection methods

Determining design coordinates for wafer defects

Contour-based defect detection using an inspection apparatus

Scanner performance comparison and matching using design and defect...

Computer-implemented methods, carrier media, and systems for creati...

Methods and systems for generating information to be used for selec...

Methods for identifying array areas in dies formed on a wafer and m...

Methods, defect review tools, and systems for locating a defect in...

Methods and systems for generating an inspection process for an ins...

Remote live video inspection

Apparatus and methods for analyzing defects on a sample

Patents Applicationslast 30 patents

CONTOUR-BASED ARRAY INSPECTION OF PATTERNED DEFECTS

Selecting Parameters for Defect Detection Methods

SYSTEMS AND METHODS FOR PREPARATION OF SAMPLES FOR SUB-SURFACE DEFE...

Determining Design Coordinates for Wafer Defects

CONTOUR-BASED DEFECT DETECTION USING AN INSPECTION APPARATUS

Selecting One or More Parameters for Inspection of a Wafer

Scanner Performance Comparison And Matching Using Design And Defect...

METHODS AND SYSTEMS FOR GENERATING INFORMATION TO BE USED FOR SELEC...