Michael J. Varnau

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Russiaville, IN, US

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Patents Grantslast 30 patents

Information Patent Grant
Wafer-applied underfill process
- Patent number 6,916,684
- Issue date Jul 12, 2005
- Delphi Technologies, Inc.
- Frank Stepniak
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF SOLDER BUMPING A CIRCUIT COMPONENT AND CIRCUIT COMPONENT...
- Publication number 20070045840
- Publication date Mar 1, 2007
- DELPHI TECHNOLOGIES, INC
- Michael J. Varnau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP PACKAGE AND METHOD OF CONDUCTING HEAT THEREFROM
- Publication number 20060273467
- Publication date Dec 7, 2006
- DELPHI TECHNOLOGIES, INC
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed circuit board assembly and method
- Publication number 20050081375
- Publication date Apr 21, 2005
- Frederick F. Kuhlman
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Wafer-applied underfill process
- Publication number 20040185601
- Publication date Sep 23, 2004
- Frank Stepniak
- H01 - BASIC ELECTRIC ELEMENTS