Michael John Anderson

Person

Phoenix, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Surface acoustic wave device package and method
- Patent number 5,969,461
- Issue date Oct 19, 1999
- CTS Corporation
- Michael J. Anderson
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method of making a microelectronic device package
- Patent number 5,928,598
- Issue date Jul 27, 1999
- Motorola, Inc.
- Michael John Anderson
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Saw device package and method
- Patent number 5,892,417
- Issue date Apr 6, 1999
- Motorola Inc.
- Gary Carl Johnson
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Plastic encapsulated SAW device
- Patent number 5,760,526
- Issue date Jun 2, 1998
- Motorola, Inc.
- Michael John Anderson
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Acoustic wave filter package lid attachment apparatus and method ut...
- Patent number 5,729,185
- Issue date Mar 17, 1998
- Motorola Inc.
- Gary Carl Johnson
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Microelectronic device package and method
- Patent number 5,702,775
- Issue date Dec 30, 1997
- Motorola, Inc.
- Michael John Anderson
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Resistance heated, sealed microfabricated device package method and...
- Patent number 5,414,214
- Issue date May 9, 1995
- Motorola, Inc.
- Frederick Y.-T. Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monolithic circuit fabrication method
- Patent number 5,361,967
- Issue date Nov 8, 1994
- Motorola, Inc.
- Michael J. Anderson
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Michael John Anderson

Person

Patents Grantslast 30 patents

Surface acoustic wave device package and method

Method of making a microelectronic device package

Saw device package and method

Plastic encapsulated SAW device

Acoustic wave filter package lid attachment apparatus and method ut...

Microelectronic device package and method

Resistance heated, sealed microfabricated device package method and...

Monolithic circuit fabrication method