Michael Juerss

Person

Regenstauf, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic device with multi-layer contact and system
- Patent number 12,255,168
- Issue date Mar 18, 2025
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with multi-layer contact and system
- Patent number 11,842,975
- Issue date Dec 12, 2023
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clip frame assembly, semiconductor package having a lead frame and...
- Patent number 11,515,244
- Issue date Nov 29, 2022
- Infineon Technologies AG
- Bun Kian Tay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clip frame assembly, semiconductor package having a lead frame and...
- Patent number 10,964,628
- Issue date Mar 30, 2021
- Infineon Technologies AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package system
- Patent number 10,886,186
- Issue date Jan 5, 2021
- Infineon Technologies AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing electronic device with multi-layer contact
- Patent number 10,475,761
- Issue date Nov 12, 2019
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package having a dielectric layer and an encapsulant
- Patent number 10,043,782
- Issue date Aug 7, 2018
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a sealant layer including carbon direct...
- Patent number 9,953,952
- Issue date Apr 24, 2018
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with multi-layer contact
- Patent number 9,490,193
- Issue date Nov 8, 2016
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Package with Insert
- Publication number 20240178109
- Publication date May 30, 2024
- Stefan Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM
- Publication number 20240088087
- Publication date Mar 14, 2024
- INFINEON TECHNOLOGIES AG
- Alexander HEINRICH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A LEAD FRAME AND A CLIP FRAME
- Publication number 20230051100
- Publication date Feb 16, 2023
- INFINEON TECHNOLOGIES AG
- Bun Kian Tay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A LEAD FRAME AND A CLIP FRAME
- Publication number 20210166998
- Publication date Jun 3, 2021
- INFINEON TECHNOLOGIES AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Clip Frame Assembly, Semiconductor Package Having a Lead Frame and...
- Publication number 20200273790
- Publication date Aug 27, 2020
- Bun Kian Tay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Clip Frame Assembly, Semiconductor Package Having a Lead Frame and...
- Publication number 20200273781
- Publication date Aug 27, 2020
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device with Multi-Layer Contact and System
- Publication number 20200075530
- Publication date Mar 5, 2020
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat Dissipation Device, Semiconductor Packaging System and Method...
- Publication number 20200006187
- Publication date Jan 2, 2020
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SYSTEM
- Publication number 20190304858
- Publication date Oct 3, 2019
- INFINEON TECHNOLOGIES AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing Electronic Device With Multi-Layer Contact
- Publication number 20190006311
- Publication date Jan 3, 2019
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
An Electronic Device Package
- Publication number 20180350780
- Publication date Dec 6, 2018
- INFINEON TECHNOLOGIES AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device Package Having a Dielectric Layer and an Encapsulant
- Publication number 20170287880
- Publication date Oct 5, 2017
- INFINEON TECHNOLOGIES AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device with Multi-Layer Contact
- Publication number 20170025375
- Publication date Jan 26, 2017
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF CONNECTING A SUBSTRATE AND CHIP ASSEMBLY
- Publication number 20160126165
- Publication date May 5, 2016
- INFINEON TECHNOLOGIES AG
- Paul FRANK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device and a Method for Fabricating an Electronic Device
- Publication number 20130140685
- Publication date Jun 6, 2013
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20100044841
- Publication date Feb 25, 2010
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS

Michael Juerss

Person

Patents Grantslast 30 patents

Electronic device with multi-layer contact and system

Electronic device with multi-layer contact and system

Clip frame assembly, semiconductor package having a lead frame and...

Clip frame assembly, semiconductor package having a lead frame and...

Semiconductor package system

Method for producing electronic device with multi-layer contact

Electronic device package having a dielectric layer and an encapsulant

Semiconductor device having a sealant layer including carbon direct...

Electronic device with multi-layer contact

Patents Applicationslast 30 patents

Semiconductor Package with Insert

ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM

SEMICONDUCTOR PACKAGE HAVING A LEAD FRAME AND A CLIP FRAME

SEMICONDUCTOR PACKAGE HAVING A LEAD FRAME AND A CLIP FRAME

Clip Frame Assembly, Semiconductor Package Having a Lead Frame and...

Clip Frame Assembly, Semiconductor Package Having a Lead Frame and...

Electronic Device with Multi-Layer Contact and System

Heat Dissipation Device, Semiconductor Packaging System and Method...

SEMICONDUCTOR PACKAGE SYSTEM

Method for Producing Electronic Device With Multi-Layer Contact

An Electronic Device Package

Electronic Device Package Having a Dielectric Layer and an Encapsulant

Electronic Device with Multi-Layer Contact

METHOD OF CONNECTING A SUBSTRATE AND CHIP ASSEMBLY

Electronic Device and a Method for Fabricating an Electronic Device

SEMICONDUCTOR DEVICE