Michael Kiene

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Radebeul, DE

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Patents Grantslast 30 patents

Information Patent Grant
Nitrogen-enriched low-k barrier layer for a copper metallization layer
- Patent number 7,022,602
- Issue date Apr 4, 2006
- Advanced Micro Devices, Inc.
- Hartmut Ruelke
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor device including a low-k metallization layer stack fo...
- Publication number 20060043588
- Publication date Mar 2, 2006
- Christof Streck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Nitrogen-enriched low-k barrier layer for a copper metallization layer
- Publication number 20040214430
- Publication date Oct 28, 2004
- Hartmut Ruelke
- H01 - BASIC ELECTRIC ELEMENTS