Michael KNABL

Person

Sattendorf, AT

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing a semiconductor device having frame structu...
- Patent number 11,990,520
- Issue date May 21, 2024
- Infineon Technologies AG
- Andre Brockmeier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a semiconductor wafer, semiconductor wafer, an...
- Patent number 11,610,817
- Issue date Mar 21, 2023
- Infineon Technologies Austria AG
- Andreas Kitzler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a semiconductor wafer, semiconductor composit...
- Patent number 11,515,264
- Issue date Nov 29, 2022
- Infineon Technologies AG
- Francisco Javier Santos Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing a semiconductor de...
- Patent number 11,211,459
- Issue date Dec 28, 2021
- Infineon Technologies AG
- Andre Brockmeier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor devices
- Patent number 10,580,753
- Issue date Mar 3, 2020
- Infineon Technologies AG
- Martin Mischitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal deposition on substrates
- Patent number 9,698,106
- Issue date Jul 4, 2017
- Infineon Technologies Austria AG
- Kae-Horng Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metal deposition on substrates
- Patent number 9,318,446
- Issue date Apr 19, 2016
- Infineon Technologies Austria AG
- Kae-Horng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and a method for manufacturing a chip package
- Patent number 8,841,768
- Issue date Sep 23, 2014
- Infineon Technologies AG
- Carsten Von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for Processing a Semiconductor Wafer and Semiconductor Compo...
- Publication number 20220359428
- Publication date Nov 10, 2022
- Francisco Javier Santos Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING A SEMICONDUCTOR WAFER, SEMICONDUCTOR WAFER, AN...
- Publication number 20220301933
- Publication date Sep 22, 2022
- Andreas Kitzler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE HAVING FRAME STRUCTU...
- Publication number 20220085174
- Publication date Mar 17, 2022
- Andre Brockmeier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacturing a Semiconductor De...
- Publication number 20200194558
- Publication date Jun 18, 2020
- Andre Brockmeier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Processing a Semiconductor Wafer, Semiconductor Composit...
- Publication number 20190363057
- Publication date Nov 28, 2019
- Francisco Javier Santos Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20190027464
- Publication date Jan 24, 2019
- INFINEON TECHNOLOGIES AG
- Martin Mischitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Deposition on Substrates
- Publication number 20160203979
- Publication date Jul 14, 2016
- Infineon Technologies Austria AG
- Kae-Horng Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Metal Deposition on Substrates
- Publication number 20140264779
- Publication date Sep 18, 2014
- Infineon Technologies Austria AG
- Kae-Horng Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE
- Publication number 20140021610
- Publication date Jan 23, 2014
- INFINEON TECHNOLOGIES AG
- Carsten VON KOBLINSKI
- H01 - BASIC ELECTRIC ELEMENTS

Michael KNABL

Person

Patents Grantslast 30 patents

Method of manufacturing a semiconductor device having frame structu...

Method of processing a semiconductor wafer, semiconductor wafer, an...

Method for processing a semiconductor wafer, semiconductor composit...

Semiconductor device and method of manufacturing a semiconductor de...

Method for manufacturing semiconductor devices

Metal deposition on substrates

Metal deposition on substrates

Chip package and a method for manufacturing a chip package

Patents Applicationslast 30 patents

Method for Processing a Semiconductor Wafer and Semiconductor Compo...

METHOD OF PROCESSING A SEMICONDUCTOR WAFER, SEMICONDUCTOR WAFER, AN...

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE HAVING FRAME STRUCTU...

Semiconductor Device and Method of Manufacturing a Semiconductor De...

Method for Processing a Semiconductor Wafer, Semiconductor Composit...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES

Metal Deposition on Substrates

Metal Deposition on Substrates

CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE