MICHAEL KUHNLE

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HYDE PARK, VT, US

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Patents Grantslast 30 patents

Information Patent Grant
Apparatus for temporary wafer bonding and debonding
- Patent number 8,181,688
- Issue date May 22, 2012
- Suss Microtec Lithography, GmbH
- Hale Johnson
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS FOR TEMPORARY WAFER BONDING AND DEBONDING
- Publication number 20110014774
- Publication date Jan 20, 2011
- SUSS MICROTEC INC
- HALE JOHNSON
- B32 - LAYERED PRODUCTS