Michael L. Cooper

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San Diego, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Micro-link high-bandwidth chip-to-chip bus
- Patent number 8,898,365
- Issue date Nov 25, 2014
- Oracle International Corporation
- Robert P. Masleid
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MICRO-LINK HIGH-BANDWIDTH CHIP-TO-CHIP BUS
- Publication number 20130254448
- Publication date Sep 26, 2013
- Oracle International Corporation
- Robert P. Masleid
- H01 - BASIC ELECTRIC ELEMENTS