Michael L. Krumnow

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Plano, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Sealing and protecting integrated circuit bonding pads
- Patent number 7,262,126
- Issue date Aug 28, 2007
- Texas Instruments Incorporated
- Christo P. Bojkov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sealing and protecting integrated circuit bonding pads
- Patent number 6,927,493
- Issue date Aug 9, 2005
- Texas Instruments Incorporated
- Christo P. Bojkov
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Sealing and protecting integrated circuit bonding pads
- Publication number 20050245076
- Publication date Nov 3, 2005
- Christo P. Bojkov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sealing and protecting integrated circuit bonding pads
- Publication number 20050073048
- Publication date Apr 7, 2005
- Christo P. Bojkov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and method for pulse current plating
- Publication number 20040140219
- Publication date Jul 22, 2004
- TEXAS INSTRUMENTS INCORPORATED
- Christo P. Bojkov
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR