Michael LANGENBUCH

Person

Muenchen, DE

People

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT CONNECTION AS A DEVICE
- Publication number 20250005254
- Publication date Jan 2, 2025
- Intel Corporation
- Nicolas RICHAUD
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Routing and Passive Components in a Direct Bonding Layer
- Publication number 20250006630
- Publication date Jan 2, 2025
- Intel Corporation
- Carla Moran Guizan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Waveguides for Semiconductor Technology
- Publication number 20250006668
- Publication date Jan 2, 2025
- Intel Corporation
- Carla Moran Guizan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CAPACITOR
- Publication number 20240429269
- Publication date Dec 26, 2024
- Intel Corporation
- Peter BAUMGARTNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS LAYERS AND CAPACITORS FOR USE WITH INTEGRATED CIRCUIT PACKAGES
- Publication number 20240429221
- Publication date Dec 26, 2024
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC MATERIAL AND A MOLD COMPOUND WITH DIFFERENT DIELECTRIC C...
- Publication number 20240429117
- Publication date Dec 26, 2024
- Intel Corporation
- Harshit DHAKAD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CAPACITOR
- Publication number 20240429155
- Publication date Dec 26, 2024
- Intel Corporation
- Mamatha YAKKEGONDI VIRUPAKSHAPPA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHODS AND APPARATUS FOR IMPLEMENTING CAPACITORS IN SEMICONDUCTOR...
- Publication number 20240387353
- Publication date Nov 21, 2024
- Intel Corporation
- Michael Langenbuch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BURIED POWER RAILS INTEGRATED WITH DECOUPLING CAPACITANCE
- Publication number 20230197599
- Publication date Jun 22, 2023
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die, Heat Spreader, Semiconductor Package, Semiconduc...
- Publication number 20230197566
- Publication date Jun 22, 2023
- Intel Corporation
- Bernd WAIDHAS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package, Semiconductor Die and Method for Forming a S...
- Publication number 20230197644
- Publication date Jun 22, 2023
- Intel Corporation
- Wolfgang MOLZER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFORMERS BASED ON BURIED POWER RAIL TECHNOLOGY
- Publication number 20230197615
- Publication date Jun 22, 2023
- Intel Corporation
- Peter BAUMGARTNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTORS AND TRANSFORMERS FORMED BY BURIED POWER RAILS
- Publication number 20230197598
- Publication date Jun 22, 2023
- Intel Corporation
- Georgios Panagopoulos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Back Side Power Supply for Electronic Devices
- Publication number 20230094594
- Publication date Mar 30, 2023
- Intel Corporation
- Wolfgang MOLZER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus, Device, Method and Computer Program for an Integrated De...
- Publication number 20220365798
- Publication date Nov 17, 2022
- Intel Corporation
- Samuel COWARD
- G06 - COMPUTING CALCULATING COUNTING

Michael LANGENBUCH

Person

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT CONNECTION AS A DEVICE

Routing and Passive Components in a Direct Bonding Layer

Integrated Waveguides for Semiconductor Technology

INTEGRATED CAPACITOR

GLASS LAYERS AND CAPACITORS FOR USE WITH INTEGRATED CIRCUIT PACKAGES

DIELECTRIC MATERIAL AND A MOLD COMPOUND WITH DIFFERENT DIELECTRIC C...

INTEGRATED CAPACITOR

METHODS AND APPARATUS FOR IMPLEMENTING CAPACITORS IN SEMICONDUCTOR...

BURIED POWER RAILS INTEGRATED WITH DECOUPLING CAPACITANCE

Semiconductor Die, Heat Spreader, Semiconductor Package, Semiconduc...

Semiconductor Package, Semiconductor Die and Method for Forming a S...

TRANSFORMERS BASED ON BURIED POWER RAIL TECHNOLOGY

INDUCTORS AND TRANSFORMERS FORMED BY BURIED POWER RAILS

Back Side Power Supply for Electronic Devices

Apparatus, Device, Method and Computer Program for an Integrated De...