Michael Liehr

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Essex Junction, VT, US

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Patents Grantslast 30 patents

Information Patent Grant
Method for direct chip attach by solder bumps and an underfill layer
- Patent number 6,341,418
- Issue date Jan 29, 2002
- International Business Machines Corporation
- Guy P. Brouillette
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making interconnect for low temperature chip attachment
- Patent number 6,340,630
- Issue date Jan 22, 2002
- International Business Machines Corporation
- Daniel George Berger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect for low temperature chip attachment
- Patent number 6,127,735
- Issue date Oct 3, 2000
- International Business Machines Corporation
- Daniel George Berger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct chip attach for low alpha emission interconnect system
- Patent number 5,897,336
- Issue date Apr 27, 1999
- International Business Machines Corporation
- Guy Paul Brouillette
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for direct chip attach by solder bumps and an underfill layer
- Publication number 20020062556
- Publication date May 30, 2002
- International Business Machines Corporation
- Guy P. Brouillette
- H01 - BASIC ELECTRIC ELEMENTS