Michael M. DUBE

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Saco, ME, US

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Patents Grantslast 30 patents

Information Patent Grant
Package including a semiconductor die and a capacitive component
- Patent number 9,478,519
- Issue date Oct 25, 2016
- Fairchild Semiconductor Corporation
- Ahmad R. Ashrafzadeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus related to an improved package including a semiconductor die
- Patent number 9,177,925
- Issue date Nov 3, 2015
- Fairfchild Semiconductor Corporation
- Ahmad R. Ashrafzadeh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE INCLUDING A SEMICONDUCTOR DIE AND A CAPACITIVE COMPONENT
- Publication number 20160126219
- Publication date May 5, 2016
- Fairchild Semiconductor Corporation
- Ahmad R. ASHRAFZADEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS RELATED TO AN IMPROVED PACKAGE INCLUDING A SE...
- Publication number 20140312458
- Publication date Oct 23, 2014
- Fairchild Semiconductor Corporation
- Ahmad ASHRAFZADEH
- H01 - BASIC ELECTRIC ELEMENTS