Michael Miyake

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Placentia, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Stackable modules and multimodular assemblies
- Patent number 5,701,233
- Issue date Dec 23, 1997
- Irvine Sensors Corporation
- John C. Carson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-conductive end layer for integrated stack of IC chips
- Patent number 5,424,920
- Issue date Jun 13, 1995
- Irvine Sensors Corporation
- Michael K. Miyake
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
High density array module and connector
- Publication number 20110147568
- Publication date Jun 23, 2011
- Irvine Sensors Corporation
- Michael Miyake
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermal management device comprising thermally conductive heat spre...
- Publication number 20110085304
- Publication date Apr 14, 2011
- Irvine Sensors Corporation
- Randy Bindrup
- H01 - BASIC ELECTRIC ELEMENTS