Michael Murphy

Person

Albany, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
In-situ lithography pattern enhancement with localized stress treat...
- Patent number 11,994,807
- Issue date May 28, 2024
- Tokyo Electron Limited
- Andrew Weloth
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method for recessing a fill material within openings formed on a pa...
- Patent number 11,848,236
- Issue date Dec 19, 2023
- Tokyo Electron Limited
- Anton deVilliers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Freeze-less methods for self-aligned double patterning
- Patent number 11,747,733
- Issue date Sep 5, 2023
- Tokyo Electron Limited
- Michael Murphy
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method to form narrow slot contacts
- Patent number 11,682,559
- Issue date Jun 20, 2023
- Tokyo Electron Limited
- Michael Murphy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controlling semiconductor film thickness
- Patent number 11,656,550
- Issue date May 23, 2023
- Tokyo Electron Limited
- Daniel Fulford
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INORGANIC/HYBRID STRESS FILMS
- Publication number 20240363340
- Publication date Oct 31, 2024
- TOKYO ELECTRON LIMITED
- Charlotte Cutler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-SITU LITHOGRAPHY PATTERN ENHANCEMENT WITH LOCALIZED STRESS TREAT...
- Publication number 20240201601
- Publication date Jun 20, 2024
- TOKYO ELECTRON LIMITED
- Andrew WELOTH
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Patterning Semiconductor Features
- Publication number 20240168384
- Publication date May 23, 2024
- TOKYO ELECTRON LIMITED
- Michael Murphy
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
PATTERNING A SEMICONDUCTOR WORKPIECE
- Publication number 20240085795
- Publication date Mar 14, 2024
- TOKYO ELECTRON LIMITED
- Jodi Grzeskowiak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-SITU LITHOGRAPHY PATTERN ENHANCEMENT WITH LOCALIZED STRESS TREAT...
- Publication number 20230359128
- Publication date Nov 9, 2023
- TOKYO ELECTRON LIMITED
- Andrew WELOTH
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
TOP-DOWN SELF-ALIGNMENT OF VIAS IN A SEMICONDUCTOR DEVICE FOR SUB-2...
- Publication number 20230352343
- Publication date Nov 2, 2023
- TOKYO ELECTRON LIMITED
- Jeffrey SMITH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self Aligned Multiple Patterning Method
- Publication number 20230290676
- Publication date Sep 14, 2023
- TOKYO ELECTRON LIMITED
- David Power
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO FORM NARROW SLOT CONTACTS
- Publication number 20230274940
- Publication date Aug 31, 2023
- TOKYO ELECTRON LIMITED
- Michael MURPHY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective Deprotection via Dye Diffusion
- Publication number 20230251570
- Publication date Aug 10, 2023
- TOKYO ELECTRON LIMITED
- Michael MURPHY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Patterns
- Publication number 20230052800
- Publication date Feb 16, 2023
- TOKYO ELECTRON LIMITED
- Daniel Fulford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ADJUSTING WAFER SHAPE USING MULTI-DIRECTIONAL ACTUATION F...
- Publication number 20230008350
- Publication date Jan 12, 2023
- TOKYO ELECTRON LIMITED
- Charlotte CUTLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REMOVING MATERIAL OVERBURDEN VIA ENHANCED FREEZE-LESS AN...
- Publication number 20220388232
- Publication date Dec 8, 2022
- TOKYO ELECTRON LIMITED
- Charlotte CUTLER
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
METHOD OF CORRECTING WAFER BOW USING A DIRECT WRITE STRESS FILM
- Publication number 20220336226
- Publication date Oct 20, 2022
- TOKYO ELECTRON LIMITED
- Charlotte CUTLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Freeze-less Methods for Self-Aligned Double Patterning
- Publication number 20220221797
- Publication date Jul 14, 2022
- TOKYO ELECTRON LIMITED
- Michael Murphy
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Method for Recessing a Fill Material Within Openings Formed on a Pa...
- Publication number 20220172991
- Publication date Jun 2, 2022
- TOKYO ELECTRON LIMITED
- Anton deVilliers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLING SEMICONDUCTOR FILM THICKNESS
- Publication number 20220066317
- Publication date Mar 3, 2022
- TOKYO ELECTRON LIMITED
- Daniel Fulford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO FORM NARROW SLOT CONTACTS
- Publication number 20210391180
- Publication date Dec 16, 2021
- TOKYO ELECTRON LIMITED
- Michael Murphy
- H01 - BASIC ELECTRIC ELEMENTS

Michael Murphy

Person

Patents Grantslast 30 patents

In-situ lithography pattern enhancement with localized stress treat...

Method for recessing a fill material within openings formed on a pa...

Freeze-less methods for self-aligned double patterning

Method to form narrow slot contacts

Controlling semiconductor film thickness

Patents Applicationslast 30 patents

INORGANIC/HYBRID STRESS FILMS

IN-SITU LITHOGRAPHY PATTERN ENHANCEMENT WITH LOCALIZED STRESS TREAT...

Patterning Semiconductor Features

PATTERNING A SEMICONDUCTOR WORKPIECE

IN-SITU LITHOGRAPHY PATTERN ENHANCEMENT WITH LOCALIZED STRESS TREAT...

TOP-DOWN SELF-ALIGNMENT OF VIAS IN A SEMICONDUCTOR DEVICE FOR SUB-2...

Self Aligned Multiple Patterning Method

METHOD TO FORM NARROW SLOT CONTACTS

Selective Deprotection via Dye Diffusion

Methods of Forming Patterns

METHOD OF ADJUSTING WAFER SHAPE USING MULTI-DIRECTIONAL ACTUATION F...

METHOD FOR REMOVING MATERIAL OVERBURDEN VIA ENHANCED FREEZE-LESS AN...

METHOD OF CORRECTING WAFER BOW USING A DIRECT WRITE STRESS FILM

Freeze-less Methods for Self-Aligned Double Patterning

Method for Recessing a Fill Material Within Openings Formed on a Pa...

CONTROLLING SEMICONDUCTOR FILM THICKNESS

METHOD TO FORM NARROW SLOT CONTACTS