Michael Nelhiebel

Person

Villach, AT

People

Patents Grantslast 30 patents

Information Patent Grant
Prognostic health management for power devices
- Patent number 11,443,990
- Issue date Sep 13, 2022
- Infineon Technologies AG
- Sergio De Gasperi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device power metallization layer with stress-relievin...
- Patent number 11,276,624
- Issue date Mar 15, 2022
- Infineon Technologies Austria AG
- Michael Nelhiebel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of forming the semiconductor device
- Patent number 11,171,049
- Issue date Nov 9, 2021
- Infineon Technologies AG
- Werner Robl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier for power metallization in semiconductor devices
- Patent number 11,127,693
- Issue date Sep 21, 2021
- Infineon Technologies AG
- Johann Gatterbauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing a semiconductor device having a power metal...
- Patent number 10,978,395
- Issue date Apr 13, 2021
- Infineon Technologies Austria AG
- Ravi Keshav Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with copper structure
- Patent number 10,937,720
- Issue date Mar 2, 2021
- Infineon Technologies Austria AG
- Silvia Larisegger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power metallization structure for semiconductor devices
- Patent number 10,734,320
- Issue date Aug 4, 2020
- Infineon Technologies Austria AG
- Ravi Keshav Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with compressive interlayer
- Patent number 10,700,019
- Issue date Jun 30, 2020
- Infineon Technologies AG
- Marianne Mataln
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device with compressive interlayer
- Patent number 10,658,309
- Issue date May 19, 2020
- Infineon Technologies AG
- Marianne Mataln
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device having a copper element and method of forming...
- Patent number 10,446,469
- Issue date Oct 15, 2019
- Infineon Technologies AG
- Thomas Detzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a load current component and a sensor c...
- Patent number 10,396,067
- Issue date Aug 27, 2019
- Infineon Technologies AG
- Stefan Decker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-organizing barrier layer disposed between a metallization laye...
- Patent number 10,332,793
- Issue date Jun 25, 2019
- Infineon Technologies Austria AG
- Werner Robl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compressive interlayer having a defined crack-stop edge extension
- Patent number 10,304,782
- Issue date May 28, 2019
- Infineon Technologies AG
- Marianne Mataln
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including self-protecting current sensor
- Patent number 10,249,612
- Issue date Apr 2, 2019
- Infineon Technologies AG
- Stefan Decker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically conductive element, power semiconductor device having...
- Patent number 9,812,376
- Issue date Nov 7, 2017
- Infineon Technologies AG
- Stefan Woehlert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for testing electric conductors
- Patent number 9,523,729
- Issue date Dec 20, 2016
- Infineon Technologies AG
- Michael Nelhiebel
- G01 - MEASURING TESTING
Information Patent Grant
Integrated circuit and method of forming an integrated circuit
- Patent number 9,418,937
- Issue date Aug 16, 2016
- Infineon Technologies AG
- Thomas Detzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit including power transistor cells and a connectin...
- Patent number 8,502,274
- Issue date Aug 6, 2013
- Infineon Technologies AG
- Kurt Matoy
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SCANNING ELECTRON MICROSCOPY-BASED SAMPLE ANALYSIS
- Publication number 20250022681
- Publication date Jan 16, 2025
- INFINEON TECHNOLOGIES AG
- Maximilian Alexander MOSER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Current Measuring Circuit
- Publication number 20230194595
- Publication date Jun 22, 2023
- INFINEON TECHNOLOGIES AG
- Christian Djelassi-Tscheck
- G01 - MEASURING TESTING
Information Patent Application
PROGNOSTIC HEALTH MANAGEMENT FOR POWER DEVICES
- Publication number 20210407870
- Publication date Dec 30, 2021
- INFINEON TECHNOLOGIES AG
- Sergio De Gasperi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Power Metallization Layer with Stress-Relievin...
- Publication number 20210183732
- Publication date Jun 17, 2021
- Michael Nelhiebel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing a Semiconductor Device Having a Power Metal...
- Publication number 20200335448
- Publication date Oct 22, 2020
- Ravi Keshav Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Barrier for Power Metallization in Semiconductor Devices
- Publication number 20200111754
- Publication date Apr 9, 2020
- Johann Gatterbauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Power Metallization Structure for Semiconductor Devices
- Publication number 20200035610
- Publication date Jan 30, 2020
- Infineon Technologies Austria AG
- Ravi Keshav Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Copper Structure
- Publication number 20190304884
- Publication date Oct 3, 2019
- Silvia Larisegger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Compressive Interlayer
- Publication number 20190273050
- Publication date Sep 5, 2019
- Marianne Mataln
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF FORMING THE SEMICONDUCTOR DEVICE
- Publication number 20190267283
- Publication date Aug 29, 2019
- Infineon Technologies Austria AG
- Werner Robl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having a Load Current Component and a Sensor C...
- Publication number 20190157258
- Publication date May 23, 2019
- INFINEON TECHNOLOGIES AG
- Stefan Decker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Compressive Interlayer Having a Defined Crack-Stop Edge Extension
- Publication number 20190067209
- Publication date Feb 28, 2019
- INFINEON TECHNOLOGIES AG
- Marianne Mataln
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ORGANIZING BARRIER LAYER DISPOSED BETWEEN A METALLIZATION LAYE...
- Publication number 20170154813
- Publication date Jun 1, 2017
- Infineon Technologies Austria AG
- Werner Robl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having a Copper Element and Method of Forming...
- Publication number 20160329263
- Publication date Nov 10, 2016
- INFINEON TECHNOLOGIES AG
- Thomas Detzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrically Conductive Element, Power Semiconductor Device Having...
- Publication number 20160013117
- Publication date Jan 14, 2016
- INFINEON TECHNOLOGIES AG
- Stefan Woehlert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device
- Publication number 20150333060
- Publication date Nov 19, 2015
- INFINEON TECHNOLOGIES AG
- Stefan Decker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and Method for Testing Electric Conductors
- Publication number 20150077151
- Publication date Mar 19, 2015
- INFINEON TECHNOLOGIES AG
- Michael Nelhiebel
- G01 - MEASURING TESTING
Information Patent Application
Integrated Circuit and Method of Forming an Integrated Circuit
- Publication number 20130147047
- Publication date Jun 13, 2013
- INFINEON TECHNOLOGIES AG
- Thomas Detzel
- H01 - BASIC ELECTRIC ELEMENTS

Michael Nelhiebel

Person

Patents Grantslast 30 patents

Prognostic health management for power devices

Semiconductor device power metallization layer with stress-relievin...

Semiconductor device and a method of forming the semiconductor device

Barrier for power metallization in semiconductor devices

Method of manufacturing a semiconductor device having a power metal...

Semiconductor device with copper structure

Power metallization structure for semiconductor devices

Semiconductor device with compressive interlayer

Semiconductor device with compressive interlayer

Semiconductor device having a copper element and method of forming...

Semiconductor device having a load current component and a sensor c...

Self-organizing barrier layer disposed between a metallization laye...

Compressive interlayer having a defined crack-stop edge extension

Semiconductor device including self-protecting current sensor

Electrically conductive element, power semiconductor device having...

Apparatus and method for testing electric conductors

Integrated circuit and method of forming an integrated circuit

Integrated circuit including power transistor cells and a connectin...

Patents Applicationslast 30 patents

SCANNING ELECTRON MICROSCOPY-BASED SAMPLE ANALYSIS

Current Measuring Circuit

PROGNOSTIC HEALTH MANAGEMENT FOR POWER DEVICES

Semiconductor Device Power Metallization Layer with Stress-Relievin...

Method of Manufacturing a Semiconductor Device Having a Power Metal...

Barrier for Power Metallization in Semiconductor Devices

Power Metallization Structure for Semiconductor Devices

Semiconductor Device with Copper Structure

Semiconductor Device with Compressive Interlayer

SEMICONDUCTOR DEVICE AND A METHOD OF FORMING THE SEMICONDUCTOR DEVICE

Semiconductor Device Having a Load Current Component and a Sensor C...

Compressive Interlayer Having a Defined Crack-Stop Edge Extension

SELF-ORGANIZING BARRIER LAYER DISPOSED BETWEEN A METALLIZATION LAYE...

Semiconductor Device Having a Copper Element and Method of Forming...

Electrically Conductive Element, Power Semiconductor Device Having...

Semiconductor Device

Apparatus and Method for Testing Electric Conductors

Integrated Circuit and Method of Forming an Integrated Circuit