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Michael Newman
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Fort Collins, CO, US
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Patents Grants
last 30 patents
Information
Patent Grant
Method and structures for heat dissipating interposers
Patent number
10,475,733
Issue date
Nov 12, 2019
Invensas Corporation
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of fabricating a carrier-less silicon interposer using photo...
Patent number
10,403,510
Issue date
Sep 3, 2019
Invensas Corporation
Andrew Cao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of fabricating low CTE interposer without TSV structure
Patent number
10,396,114
Issue date
Aug 27, 2019
Invensas Corporation
Charles G. Woychik
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for fabricating a carrier-less silicon interposer
Patent number
10,181,411
Issue date
Jan 15, 2019
Invensas Corporation
Michael Newman
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method and structures for heat dissipating interposers
Patent number
10,103,094
Issue date
Oct 16, 2018
Invensas Corporation
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Reliable device assembly
Patent number
9,893,030
Issue date
Feb 13, 2018
Invensas Corporation
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Carrier-less silicon interposer using photo patterned polymer as su...
Patent number
9,691,693
Issue date
Jun 27, 2017
Invensas Corporation
Andrew Cao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Structures for heat dissipating interposers
Patent number
9,685,401
Issue date
Jun 20, 2017
Invensas Corporation
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of fabricating low CTE interposer without TSV structure
Patent number
9,558,964
Issue date
Jan 31, 2017
Invensas Corporation
Charles G. Woychik
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
BVA interposer
Patent number
9,502,390
Issue date
Nov 22, 2016
Invensas Corporation
Terrence Caskey
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming a reliable microelectronic assembly
Patent number
9,398,700
Issue date
Jul 19, 2016
Invensas Corporation
Cyprian Emeka Uzoh
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Metal PVD-free conducting structures
Patent number
9,379,008
Issue date
Jun 28, 2016
Invensas Corporation
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods and structure for carrier-less thin wafer handling
Patent number
9,355,905
Issue date
May 31, 2016
Invensas Corporation
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Surface modified TSV structure and methods thereof
Patent number
9,312,175
Issue date
Apr 12, 2016
Invensas Corporation
Belgacem Haba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Carrier-less silicon interposer
Patent number
9,237,648
Issue date
Jan 12, 2016
Invensas Corporation
Michael Newman
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method and structures for heat dissipating interposers
Patent number
9,123,780
Issue date
Sep 1, 2015
Invensas Corporation
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods and structure for carrier-less thin wafer handling
Patent number
9,064,933
Issue date
Jun 23, 2015
Invensas Corporation
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metal PVD-free conducting structures
Patent number
8,981,564
Issue date
Mar 17, 2015
Invensas Corporation
Charles G. Woychik
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Low CTE interposer without TSV structure
Patent number
8,884,427
Issue date
Nov 11, 2014
Invensas Corporation
Charles G. Woychik
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
METHOD AND STRUCTURES FOR HEAT DISSIPATING INTERPOSERS
Publication number
20190139878
Publication date
May 9, 2019
Invensas Corporation
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD AND STRUCTURES FOR HEAT DISSIPATING INTERPOSERS
Publication number
20170365546
Publication date
Dec 21, 2017
Invensas Corporation
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Carrier-Less Silicon Interposer Using Photo Patterned Polymer as Su...
Publication number
20170294321
Publication date
Oct 12, 2017
Invensas Corporation
Andrew Cao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FABRICATING LOW CTE INTERPOSER WITHOUT TSV STRUCTURE
Publication number
20170194373
Publication date
Jul 6, 2017
Invensas Corporation
Charles G. Woychik
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Reliable Device Assembly
Publication number
20160329290
Publication date
Nov 10, 2016
Invensas Corporation
Belgacem Haba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BVA INTERPOSER
Publication number
20160079214
Publication date
Mar 17, 2016
Invensas Corporation
Terrence Caskey
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CARRIER-LESS SILICON INTERPOSER
Publication number
20160079090
Publication date
Mar 17, 2016
Invensas Corporation
Michael Newman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD AND STRUCTURES FOR HEAT DISSIPATING INTERPOSERS
Publication number
20150340310
Publication date
Nov 26, 2015
Invensas Corporation
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND STRUCTURE FOR CARRIER-LESS THIN WAFER HANDLING
Publication number
20150255345
Publication date
Sep 10, 2015
Invensas Corporation
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METAL PVD-FREE CONDUCTING STRUCTURES
Publication number
20150162241
Publication date
Jun 11, 2015
Invensas Corporation
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CARRIER-LESS SILICON INTERPOSER USING PHOTO PATTERNED POLYMER AS SU...
Publication number
20150155230
Publication date
Jun 4, 2015
Invensas Corporation
Andrew Cao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FABRICATING LOW CTE INTERPOSER WITHOUT TSV STRUCTURE
Publication number
20150044820
Publication date
Feb 12, 2015
Invensas Corporation
Charles G. Woychik
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RELIABLE DEVICE ASSEMBLY
Publication number
20140376200
Publication date
Dec 25, 2014
Invensas Corporation
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METAL PVD-FREE CONDUCTING STRUCTURES
Publication number
20140339702
Publication date
Nov 20, 2014
Invensas Corporation
Charles G. Woychik
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LOW CTE INTERPOSER WITHOUT TSV STRUCTURE
Publication number
20140264794
Publication date
Sep 18, 2014
Invensas Corporation
Charles G. Woychik
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CARRIER-LESS SILICON INTERPOSER
Publication number
20140240938
Publication date
Aug 28, 2014
Invensas Corporation
Michael Newman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND STRUCTURE FOR CARRIER-LESS THIN WAFER HANDLING
Publication number
20140179099
Publication date
Jun 26, 2014
Invensas Corporation
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SURFACE MODIFIED TSV STRUCTURE AND METHODS THEREOF
Publication number
20140175654
Publication date
Jun 26, 2014
Invensas Corporation
Belgacem Haba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD AND STRUCTURES FOR HEAT DISSIPATING INTERPOSERS
Publication number
20140167267
Publication date
Jun 19, 2014
Invensas Corporation
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BVA INTERPOSER
Publication number
20140036454
Publication date
Feb 6, 2014
Invensas Corporation
Terrence Caskey
H01 - BASIC ELECTRIC ELEMENTS