TREA

Michael Opiz Real

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  • Morgan Hill, CA, US
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Patents Grantslast 30 patents

  • Information Patent Grant

    Hybrid semiconductor package
    • Patent number 9,373,577
    • Issue date Jun 21, 2016
    • Infineon Technologies AG
    • Alexander Komposch
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Grant

    Flange for semiconductor die
    • Patent number 8,604,609
    • Issue date Dec 10, 2013
    • Infineon Technologies AG
    • Anwar A. Mohammed
    • B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
  • Information Patent Grant

    Flange for semiconductor die
    • Patent number 8,314,487
    • Issue date Nov 20, 2012
    • Infineon Technologies AG
    • Anwar A. Mohammed
    • B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...

Patents Applicationslast 30 patents

  • Information Patent Application

    Hybrid Semiconductor Package
    • Publication number 20140346637
    • Publication date Nov 27, 2014
    • Alexander Komposch
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • Information Patent Application

    Flange for Semiconductor Die
    • Publication number 20130037932
    • Publication date Feb 14, 2013
    • INFINEON TECHNOLOGIES AG
    • Anwar A. Mohammed
    • B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
  • Information Patent Application

    Flange for Semiconductor Die
    • Publication number 20110147921
    • Publication date Jun 23, 2011
    • Infineon Technologies North America Corp.
    • Anwar A. Mohammed
    • B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...