MICHAEL P. O'DAY

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Phoenix, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Techniques for enhancing fracture resistance of interconnects
- Patent number 9,691,716
- Issue date Jun 27, 2017
- Intel Corporation
- Christopher J. Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for enhancing fracture resistance of interconnects
- Patent number 9,343,411
- Issue date May 17, 2016
- Intel Corporation
- Christopher J. Jezewski
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TOPOLOGICAL CRACK STOP (TCS) PASSIVATION LAYER
- Publication number 20230108000
- Publication date Apr 6, 2023
- Intel Corporation
- Vishal JAVVAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR ENHANCING FRACTURE RESISTANCE OF INTERCONNECTS
- Publication number 20160268218
- Publication date Sep 15, 2016
- Intel Corporation
- CHRISTOPHER J. JEZEWSKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR ENHANCING FRACTURE RESISTANCE OF INTERCONNECTS
- Publication number 20140210098
- Publication date Jul 31, 2014
- Christopher J. Jezewski
- H01 - BASIC ELECTRIC ELEMENTS