Michael Pavlov

Person

Fairlawn, NJ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Palladium coating thickness measurement
- Patent number 9,593,931
- Issue date Mar 14, 2017
- ECI Technology, Inc.
- D. Morgan Tench
- G01 - MEASURING TESTING
Information Patent Grant
Analysis of an auxiliary leveler additive in an acid copper plating...
- Patent number 8,535,504
- Issue date Sep 17, 2013
- ECI Technology, Inc.
- Michael Pavlov
- G01 - MEASURING TESTING
Information Patent Grant
Chloride analysis in acid copper plating baths
- Patent number 8,142,640
- Issue date Mar 27, 2012
- ECI Technology, Inc.
- Michael Pavlov
- G01 - MEASURING TESTING
Information Patent Grant
Analysis of copper ion and complexing agent in copper plating baths
- Patent number 8,118,988
- Issue date Feb 21, 2012
- ECI Technology, Inc.
- Eugene Shalyt
- G01 - MEASURING TESTING
Information Patent Grant
Detection of additive breakdown products in acid copper plating baths
- Patent number 7,879,222
- Issue date Feb 1, 2011
- ECI Technology, Inc.
- Eugene Shalyt
- G01 - MEASURING TESTING
Information Patent Grant
Detection of an unstable additive breakdown product in a plating bath
- Patent number 7,291,253
- Issue date Nov 6, 2007
- ECI Technology, Inc.
- Michael Pavlov
- G01 - MEASURING TESTING
Information Patent Grant
Efficient analysis of organic additives in an acid copper plating bath
- Patent number 7,186,326
- Issue date Mar 6, 2007
- ECI Technology, Inc.
- Eugene Shalyt
- G01 - MEASURING TESTING
Information Patent Grant
Measurement of complexing agent concentration in an electroless pla...
- Patent number 6,890,758
- Issue date May 10, 2005
- ECI Technology, Inc.
- Eugene Shalyt
- G01 - MEASURING TESTING
Information Patent Grant
Detection of suppressor breakdown contaminants in a plating bath
- Patent number 6,749,739
- Issue date Jun 15, 2004
- ECI Technology, Inc.
- Gene Chalyt
- G01 - MEASURING TESTING
Information Patent Grant
Voltammetric reference electrode calibration
- Patent number 6,733,656
- Issue date May 11, 2004
- ECI Technology Inc.
- Gene Chalyt
- G01 - MEASURING TESTING
Information Patent Grant
Measurement of the concentration of a reducing agent in an electrol...
- Patent number 6,709,561
- Issue date Mar 23, 2004
- ECI Technology, Inc.
- Michael Pavlov
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Voltammetric measurement of halide ion concentration
- Patent number 6,673,226
- Issue date Jan 6, 2004
- ECI Technology
- Alex Kogan
- G01 - MEASURING TESTING
Information Patent Grant
Method for analysis of three organic additives in an acid copper pl...
- Patent number 6,572,753
- Issue date Jun 3, 2003
- ECI Technology, Inc.
- Gene Chalyt
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
MEASUREMENT OF TOTAL ACCELERATOR IN AN ELECTRODEPOSITION SOLUTION
- Publication number 20180202060
- Publication date Jul 19, 2018
- ECI Technology, Inc.
- Michael Pavlov
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PALLADIUM COATING THICKNESS MEASUREMENT
- Publication number 20140061064
- Publication date Mar 6, 2014
- ECI Technology, Inc.
- D. Morgan Tench
- G01 - MEASURING TESTING
Information Patent Application
Analysis of an auxiliary leveler additive in an acid copper plating...
- Publication number 20110266154
- Publication date Nov 3, 2011
- ECI Technology, Inc.
- Michael Pavlov
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Analysis of fluoride at low concentrations in acidic processing sol...
- Publication number 20090229995
- Publication date Sep 17, 2009
- ECI TECHNOLOGY, INC.
- Eugene Shalyt
- G01 - MEASURING TESTING
Information Patent Application
Analysis of copper ion and complexing agent in copper plating baths
- Publication number 20090194430
- Publication date Aug 6, 2009
- ECI TECHNOLOGY, INC.
- Eugene Shalyt
- G01 - MEASURING TESTING
Information Patent Application
Chloride analysis in acid copper plating baths
- Publication number 20090065362
- Publication date Mar 12, 2009
- ECI TECHNOLOGY, INC.
- Michael Pavlov
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Detection of additive breakdown products in acid copper plating baths
- Publication number 20090057151
- Publication date Mar 5, 2009
- ECI TECHNOLOGY, INC.
- Eugene Shalyt
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Efficient analysis of organic additives in an acid copper plating bath
- Publication number 20050263399
- Publication date Dec 1, 2005
- ECI TECHNOLOGY, INC.
- Eugene Shalyt
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Detection of an unstable additive breakdown product in a plating bath
- Publication number 20050247577
- Publication date Nov 10, 2005
- ECI TECHNOLOGY, INC.
- Michael Pavlov
- G01 - MEASURING TESTING
Information Patent Application
Measurement of complexing agent concentration in an electroless pla...
- Publication number 20040253740
- Publication date Dec 16, 2004
- ECI TECHNOLOGY, INC.
- Eugene Shalyt
- G01 - MEASURING TESTING
Information Patent Application
Detection of suppressor breakdown contaminants in a plating bath
- Publication number 20040065561
- Publication date Apr 8, 2004
- ECI TECHNOLOGY, INC.
- Gene Chalyt
- G01 - MEASURING TESTING
Information Patent Application
Voltammetric reference electrode calibration
- Publication number 20030188977
- Publication date Oct 9, 2003
- ECI TECHNOLOGY, INC.
- Gene Chalyt
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for analysis of three organic additives in an acid copper pl...
- Publication number 20030062266
- Publication date Apr 3, 2003
- ECI TECHNOLOGY INC.
- Gene Chalyt
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Michael Pavlov

Person

Patents Grantslast 30 patents

Palladium coating thickness measurement

Analysis of an auxiliary leveler additive in an acid copper plating...

Chloride analysis in acid copper plating baths

Analysis of copper ion and complexing agent in copper plating baths

Detection of additive breakdown products in acid copper plating baths

Detection of an unstable additive breakdown product in a plating bath

Efficient analysis of organic additives in an acid copper plating bath

Measurement of complexing agent concentration in an electroless pla...

Detection of suppressor breakdown contaminants in a plating bath

Voltammetric reference electrode calibration

Measurement of the concentration of a reducing agent in an electrol...

Voltammetric measurement of halide ion concentration

Method for analysis of three organic additives in an acid copper pl...

Patents Applicationslast 30 patents

MEASUREMENT OF TOTAL ACCELERATOR IN AN ELECTRODEPOSITION SOLUTION

PALLADIUM COATING THICKNESS MEASUREMENT

Analysis of an auxiliary leveler additive in an acid copper plating...

Analysis of fluoride at low concentrations in acidic processing sol...

Analysis of copper ion and complexing agent in copper plating baths

Chloride analysis in acid copper plating baths

Detection of additive breakdown products in acid copper plating baths

Efficient analysis of organic additives in an acid copper plating bath

Detection of an unstable additive breakdown product in a plating bath

Measurement of complexing agent concentration in an electroless pla...

Detection of suppressor breakdown contaminants in a plating bath

Voltammetric reference electrode calibration

Method for analysis of three organic additives in an acid copper pl...