Michael R. Ehlert

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Irvine, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Low temperature co-fired ceramic (LTCC) transmit/receive (T/R) asse...
- Patent number 8,116,090
- Issue date Feb 14, 2012
- BAE Systems Information and Electronic Systems Integration Inc.
- Blair Coburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Materials and structure for a high reliability BGA connection betwe...
- Patent number 7,287,323
- Issue date Oct 30, 2007
- National Semiconductor Corporation
- Michael Richard Ehlert
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Materials and structure for a high reliability bga connection betwe...
- Patent number 6,800,815
- Issue date Oct 5, 2004
- National Semiconductor Corporation
- Michael Richard Ehlert
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic electronic package design
- Patent number 5,168,344
- Issue date Dec 1, 1992
- W. R. Grace & Co.-Conn.
- Michael R. Ehlert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Domed lid for integrated circuit package
- Patent number 5,064,968
- Issue date Nov 12, 1991
- Hughes Aircraft Company
- Alan L. Kovacs
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LOW TEMPERATURE CO-FIRED CERAMIC (LTCC) TRANSMIT/RECEIVE (T/R) ASSE...
- Publication number 20100259913
- Publication date Oct 14, 2010
- BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC
- Blair Coburn
- H01 - BASIC ELECTRIC ELEMENTS