Michael R. Sievers

Person

Poughkeepsie, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
On-chip cooling for integrated circuits
- Patent number 8,492,295
- Issue date Jul 23, 2013
- International Business Machines Corporation
- Kaushik A. Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
On-chip cooling systems for integrated circuits
- Patent number 8,298,966
- Issue date Oct 30, 2012
- International Business Machines Corporation
- Kaushik A. Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal gradient control of high aspect ratio etching and depositio...
- Patent number 8,008,209
- Issue date Aug 30, 2011
- International Business Machines Corporation
- Michael R. Sievers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal oxide field effect transistor with a sharp halo
- Patent number 7,859,013
- Issue date Dec 28, 2010
- International Business Machines Corporation
- Huajie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for detecting endpoint in a dry etching system...
- Patent number 7,754,615
- Issue date Jul 13, 2010
- Tokyo Electron Limited
- Siddhartha Panda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
On-chip cooling systems for integrated circuits
- Patent number 7,659,616
- Issue date Feb 9, 2010
- International Business Machines Corporation
- Kaushik A. Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal oxide field effect transistor with a sharp halo and a method...
- Patent number 7,384,835
- Issue date Jun 10, 2008
- International Business Machines Corporation
- Huajie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Endpoint detection for the patterning of layered materials
- Patent number 7,285,775
- Issue date Oct 23, 2007
- International Business Machines Corporation
- Michael R. Sievers
- G01 - MEASURING TESTING
Information Patent Grant
Gas filled reactive atomic force microscope probe
- Patent number 7,278,300
- Issue date Oct 9, 2007
- International Business Machines Corporation
- Michael R. Sievers
- G01 - MEASURING TESTING
Information Patent Grant
Non-destructive in-situ elemental profiling
- Patent number 7,256,399
- Issue date Aug 14, 2007
- International Business Machines Corporation
- Siddhartha Panda
- G01 - MEASURING TESTING
Information Patent Grant
Ion detector for ion beam applications
- Patent number 7,119,333
- Issue date Oct 10, 2006
- International Business Machines Corporation
- Steven B. Herschbein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dry etch process to edit copper lines
- Patent number 6,900,137
- Issue date May 31, 2005
- International Business Machines Corporation
- Steven B. Herschbein
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metal dry etch using electronic field
- Patent number 6,843,893
- Issue date Jan 18, 2005
- International Business Machines Corporation
- Steven B. Herschbein
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Focused ion beam process for removal of copper
- Patent number 6,730,237
- Issue date May 4, 2004
- International Business Machines Corporation
- Michael R. Sievers
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
ON-CHIP COOLING FOR INTEGRATED CIRCUITS
- Publication number 20130012018
- Publication date Jan 10, 2013
- International Business Machines Corporation
- Kaushik A. Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ON-CHIP COOLING SYSTEMS FOR INTEGRATED CIRCUITS
- Publication number 20100136800
- Publication date Jun 3, 2010
- International Business Machines Corporation
- Kaushik A. Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Gradient Control of High Aspect Ratio Etching and Depositio...
- Publication number 20090107956
- Publication date Apr 30, 2009
- International Business Machines Corporation
- Michael R. Sievers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ON-CHIP COOLING SYSTEMS FOR INTEGRATED CIRCUITS
- Publication number 20090096056
- Publication date Apr 16, 2009
- International Business Machines Corporation
- Kaushik A. Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REMOVING MATERIAL FROM A SEMICONDUCTOR
- Publication number 20080233709
- Publication date Sep 25, 2008
- Infineon Technologies North America Corp.
- Richard Anthony Conti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL OXIDE FIELD EFFECT TRANSISTOR WITH A SHARP HALO
- Publication number 20080093629
- Publication date Apr 24, 2008
- International Business Machines Corporation
- Huajie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELEVATED TEMPERATURE CHEMICAL OXIDE REMOVAL MODULE AND PROCESS
- Publication number 20080078743
- Publication date Apr 3, 2008
- Andres F. Munoz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for detecting endpoint in a dry etching system...
- Publication number 20080026488
- Publication date Jan 31, 2008
- IBM Corporation
- Siddhartha Panda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL OXIDE FIELD EFFECT TRANSISTOR WITH A SHARP HALO AND A METHOD...
- Publication number 20070275510
- Publication date Nov 29, 2007
- International Business Machines Corporation
- Huajie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAS FILLED REACTIVE ATOMIC FORCE MICROSCOPE PROBE
- Publication number 20070068234
- Publication date Mar 29, 2007
- International Business Machines Corporation
- Michael R. Sievers
- G01 - MEASURING TESTING
Information Patent Application
POLYSILICON ETCHING METHODS
- Publication number 20070056930
- Publication date Mar 15, 2007
- International Business Machines Corporation
- Seiji Iseda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-DESTRUCTIVE IN-SITU ELEMENTAL PROFILING
- Publication number 20060227321
- Publication date Oct 12, 2006
- International Business Machines Corporation
- Siddhartha Panda
- G01 - MEASURING TESTING
Information Patent Application
ENDPOINT DETECTION FOR THE PATTERNING OF LAYERED MATERIALS
- Publication number 20060118718
- Publication date Jun 8, 2006
- Michael R. Sievers
- G01 - MEASURING TESTING
Information Patent Application
IMPROVED ION DETECTOR FOR IONBEAM APPLICATIONS
- Publication number 20060097159
- Publication date May 11, 2006
- International Business Machines Corporation
- Steven B. Herschbein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD OF ALTERING A VERY SMALL SURFACE AREA BY MULTIPLE...
- Publication number 20050016952
- Publication date Jan 27, 2005
- International Business Machines Corporation
- Hendrik F. Hamann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHODS OF ALTERING A VERY SMALL SURFACE AREA
- Publication number 20050016954
- Publication date Jan 27, 2005
- International Business Machines Corporation
- Hendrik F. Hamann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRY ETCH PROCESS TO EDIT COPPER LINES
- Publication number 20040188380
- Publication date Sep 30, 2004
- International Business Machines Corporation
- Steven B. Herschbein
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Dry etch process for copper
- Publication number 20040132287
- Publication date Jul 8, 2004
- International Business Machines Corporation
- Lawrence S. Fischer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Metal dry etch using electronic field
- Publication number 20040112857
- Publication date Jun 17, 2004
- International Business Machines Corporation
- Steven B. Herschbein
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Tool having a plurality of electrodes and corresponding method of a...
- Publication number 20040060904
- Publication date Apr 1, 2004
- International Business Machines Corporation
- Steven Brett Herschbein
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Focused ion beam process for removal of copper
- Publication number 20020195422
- Publication date Dec 26, 2002
- International Business Machines Corporation
- Michael R. Sievers
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Michael R. Sievers

Person

Patents Grantslast 30 patents

On-chip cooling for integrated circuits

On-chip cooling systems for integrated circuits

Thermal gradient control of high aspect ratio etching and depositio...

Metal oxide field effect transistor with a sharp halo

Method and apparatus for detecting endpoint in a dry etching system...

On-chip cooling systems for integrated circuits

Metal oxide field effect transistor with a sharp halo and a method...

Endpoint detection for the patterning of layered materials

Gas filled reactive atomic force microscope probe

Non-destructive in-situ elemental profiling

Ion detector for ion beam applications

Dry etch process to edit copper lines

Metal dry etch using electronic field

Focused ion beam process for removal of copper

Patents Applicationslast 30 patents

ON-CHIP COOLING FOR INTEGRATED CIRCUITS

ON-CHIP COOLING SYSTEMS FOR INTEGRATED CIRCUITS

Thermal Gradient Control of High Aspect Ratio Etching and Depositio...

ON-CHIP COOLING SYSTEMS FOR INTEGRATED CIRCUITS

METHOD FOR REMOVING MATERIAL FROM A SEMICONDUCTOR

METAL OXIDE FIELD EFFECT TRANSISTOR WITH A SHARP HALO

ELEVATED TEMPERATURE CHEMICAL OXIDE REMOVAL MODULE AND PROCESS

Method and apparatus for detecting endpoint in a dry etching system...

METAL OXIDE FIELD EFFECT TRANSISTOR WITH A SHARP HALO AND A METHOD...

GAS FILLED REACTIVE ATOMIC FORCE MICROSCOPE PROBE

POLYSILICON ETCHING METHODS

NON-DESTRUCTIVE IN-SITU ELEMENTAL PROFILING

ENDPOINT DETECTION FOR THE PATTERNING OF LAYERED MATERIALS

IMPROVED ION DETECTOR FOR IONBEAM APPLICATIONS

SYSTEM AND METHOD OF ALTERING A VERY SMALL SURFACE AREA BY MULTIPLE...

SYSTEM AND METHODS OF ALTERING A VERY SMALL SURFACE AREA

DRY ETCH PROCESS TO EDIT COPPER LINES

Dry etch process for copper

Metal dry etch using electronic field

Tool having a plurality of electrodes and corresponding method of a...

Focused ion beam process for removal of copper