Michael Rogalli

Person

Munich, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Chip package and method of forming a chip package
- Patent number 12,040,288
- Issue date Jul 16, 2024
- Infineon Technologies AG
- Harry Walter Sax
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method of forming a chip package
- Patent number 11,735,534
- Issue date Aug 22, 2023
- Infineon Technologies AG
- Harry Walter Sax
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an aluminum oxide layer, metal surface with alumi...
- Patent number 11,424,201
- Issue date Aug 23, 2022
- Infineon Technologies AG
- Michael Rogalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a copper element and method of forming...
- Patent number 10,446,469
- Issue date Oct 15, 2019
- Infineon Technologies AG
- Thomas Detzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and processing methods
- Patent number 10,103,123
- Issue date Oct 16, 2018
- Infineon Technologies AG
- Michael Rogalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit and method of forming an integrated circuit
- Patent number 9,418,937
- Issue date Aug 16, 2016
- Infineon Technologies AG
- Thomas Detzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for providing a self-aligned pad protection in a semiconduct...
- Patent number 9,385,031
- Issue date Jul 5, 2016
- Infineon Technologies AG
- Michael Rogalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for providing a self-aligned pad protection in a semiconduct...
- Patent number 9,165,821
- Issue date Oct 20, 2015
- Infineon Technologies AG
- Michael Rogalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photosensitive lacquer for providing a coating on a semiconductor s...
- Patent number 7,169,716
- Issue date Jan 30, 2007
- Infineon Technologies AG
- Michael Rogalli
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Process for the back-surface grinding of wafers
- Patent number 6,958,256
- Issue date Oct 25, 2005
- Infineon Technologies AG
- Michael Rogalli
- B24 - GRINDING POLISHING
Information Patent Grant
Method for fabricating thin metal layers from the liquid phase
- Patent number 6,790,737
- Issue date Sep 14, 2004
- Infineon Technologies AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric filling of electrical wiring planes
- Patent number 6,380,076
- Issue date Apr 30, 2002
- Infineon Technologies AG
- Markus Kirchhoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip card
- Patent number 5,917,705
- Issue date Jun 29, 1999
- Siemens Aktiengesellschaft
- Josef Kirschbauer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for forming of a silicon oxide layer on a topography
- Patent number 5,780,103
- Issue date Jul 14, 1998
- Siemens Aktiengesellschaft
- Dirk Toebben
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radiation-curable reaction resin system
- Patent number 5,468,786
- Issue date Nov 21, 1995
- Siemens Aktiengesellschaft
- Heiner Bayer
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Surface wave components with an acoustically matched damping compound
- Patent number 5,227,219
- Issue date Jul 13, 1993
- Siemens Aktiengesellschaft
- Heiner Bayer
- G10 - MUSICAL INSTRUMENTS ACOUSTICS

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE
- Publication number 20240371796
- Publication date Nov 7, 2024
- INFINEON TECHNOLOGIES AG
- Harry Walter SAX
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE
- Publication number 20230395532
- Publication date Dec 7, 2023
- INFINEON TECHNOLOGIES AG
- Harry Walter SAX
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE
- Publication number 20210375792
- Publication date Dec 2, 2021
- INFINEON TECHNOLOGIES AG
- Harry Walter SAX
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesion Enhancing Structures for a Package
- Publication number 20200043876
- Publication date Feb 6, 2020
- Evelyn Napetschnig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming an Aluminum Oxide Layer, Metal Surface with Alumi...
- Publication number 20180366427
- Publication date Dec 20, 2018
- INFINEON TECHNOLOGIES AG
- Michael Rogalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND PROCESSING METHODS
- Publication number 20170236801
- Publication date Aug 17, 2017
- INFINEON TECHNOLOGIES AG
- Michael Rogalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having a Copper Element and Method of Forming...
- Publication number 20160329263
- Publication date Nov 10, 2016
- INFINEON TECHNOLOGIES AG
- Thomas Detzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROVIDING A SELF-ALIGNED PAD PROTECTION IN A SEMICONDUCT...
- Publication number 20150357234
- Publication date Dec 10, 2015
- INFINEON TECHNOLOGIES AG
- Michael Rogalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PROCESSING A SEMICONDUCTOR DEVICE
- Publication number 20150179507
- Publication date Jun 25, 2015
- INFINEON TECHNOLOGIES AG
- Michael Rogalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND PROCESSING METHODS
- Publication number 20140110838
- Publication date Apr 24, 2014
- INFINEON TECHNOLOGIES AG
- Michael Rogalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit and Method of Forming an Integrated Circuit
- Publication number 20130147047
- Publication date Jun 13, 2013
- INFINEON TECHNOLOGIES AG
- Thomas Detzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sensor device and a method for its manufacturing
- Publication number 20080006098
- Publication date Jan 10, 2008
- INFINEON TECHNOLOGIES
- Michael Rogalli
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Photosensitive lacquer for providing a coating on a semiconductor s...
- Publication number 20050130444
- Publication date Jun 16, 2005
- Michael Rogalli
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Method for the production of a semiconductor device
- Publication number 20050090114
- Publication date Apr 28, 2005
- Michael Rogalli
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Process for the back-surface grinding of wafers
- Publication number 20040147120
- Publication date Jul 29, 2004
- Michael Rogalli
- B24 - GRINDING POLISHING
Information Patent Application
Method for fabricating thin metal layers from the liquid phase
- Publication number 20030181037
- Publication date Sep 25, 2003
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dielectric filling of electrical wiring planes
- Publication number 20010004539
- Publication date Jun 21, 2001
- Markus Kirchhoff
- H01 - BASIC ELECTRIC ELEMENTS

Michael Rogalli

Person

Patents Grantslast 30 patents

Chip package and method of forming a chip package

Chip package and method of forming a chip package

Method of forming an aluminum oxide layer, metal surface with alumi...

Semiconductor device having a copper element and method of forming...

Semiconductor devices and processing methods

Integrated circuit and method of forming an integrated circuit

Method for providing a self-aligned pad protection in a semiconduct...

Method for providing a self-aligned pad protection in a semiconduct...

Photosensitive lacquer for providing a coating on a semiconductor s...

Process for the back-surface grinding of wafers

Method for fabricating thin metal layers from the liquid phase

Dielectric filling of electrical wiring planes

Chip card

Method for forming of a silicon oxide layer on a topography

Radiation-curable reaction resin system

Surface wave components with an acoustically matched damping compound

Patents Applicationslast 30 patents

CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE

CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE

CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE

Adhesion Enhancing Structures for a Package

Method of Forming an Aluminum Oxide Layer, Metal Surface with Alumi...

SEMICONDUCTOR DEVICES AND PROCESSING METHODS

Semiconductor Device Having a Copper Element and Method of Forming...

METHOD FOR PROVIDING A SELF-ALIGNED PAD PROTECTION IN A SEMICONDUCT...

METHODS FOR PROCESSING A SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICES AND PROCESSING METHODS

Integrated Circuit and Method of Forming an Integrated Circuit

Sensor device and a method for its manufacturing

Photosensitive lacquer for providing a coating on a semiconductor s...

Method for the production of a semiconductor device

Process for the back-surface grinding of wafers

Method for fabricating thin metal layers from the liquid phase

Dielectric filling of electrical wiring planes