Michael S. Lacy

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Naperville, IL, US

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Patents Grantslast 30 patents

Information Patent Grant
Multi-layer polishing pad material for CMP
- Patent number 7,435,161
- Issue date Oct 14, 2008
- Cabot Microelectronics Corporation
- Abaneshwar Prasad
- B24 - GRINDING POLISHING
Information Patent Grant
Multi-layer polishing pad material for CMP
- Patent number 6,884,156
- Issue date Apr 26, 2005
- Cabot Microelectronics Corporation
- Abaneshwar Prasad
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
STACKED POLISHING PAD FOR HIGH TEMPERATURE APPLICATIONS
- Publication number 20080274674
- Publication date Nov 6, 2008
- Cabot Microelectronics Corporation
- Abaneshwar Prasad
- B24 - GRINDING POLISHING
Information Patent Application
Multi-layer polishing pad material for CMP
- Publication number 20050197050
- Publication date Sep 8, 2005
- Cabot Microelectronics Corporation
- Abaneshwar Prasad
- B24 - GRINDING POLISHING
Information Patent Application
Multi-layer polishing pad material for CMP
- Publication number 20040259484
- Publication date Dec 23, 2004
- Cabot Microelectronics Corporation
- Abaneshwar Prasad
- B24 - GRINDING POLISHING