Michael Sackrison

Person

Bethlehem, PA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Underfill for light emitting device
- Patent number 7,843,074
- Issue date Nov 30, 2010
- Lumination LLC
- Xiang Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package for very small footprint and low profile white...
- Patent number 7,718,449
- Issue date May 18, 2010
- Lumination LLC
- Xiang Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optimized contact design for thermosonic bonding of flip-chip devices
- Patent number 7,667,236
- Issue date Feb 23, 2010
- Lumination LLC
- Ivan Eliashevich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Increased light extraction from a nitride LED
- Patent number 7,125,734
- Issue date Oct 24, 2006
- Gelcore, LLC
- Michael J. Sackrison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser separation of encapsulated submount
- Patent number 7,087,463
- Issue date Aug 8, 2006
- Gelcore, LLC
- Michael Sackrison
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LASER LIFT-OFF WITH IMPROVED LIGHT EXTRACTION
- Publication number 20100181584
- Publication date Jul 22, 2010
- Xiang Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Small footprint high power light emitting package with plurality of...
- Publication number 20080121902
- Publication date May 29, 2008
- GELCORE LLC
- Michael Sackrison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Underfill for light emitting device
- Publication number 20080061312
- Publication date Mar 13, 2008
- GELCORE LLC
- Xiang Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer level package for very small footprint and low profile white...
- Publication number 20070202623
- Publication date Aug 30, 2007
- GELCORE LLC
- Xiang Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optimized contact design for thermosonic bonding of flip-chip devices
- Publication number 20070145379
- Publication date Jun 28, 2007
- Ivan Eliashevich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laser separation of encapsulated submount
- Publication number 20070004088
- Publication date Jan 4, 2007
- GELCORE, LLC
- Michael Sackrison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INCREASED LIGHT EXTRACTION FROM A NITRIDE LED
- Publication number 20060202223
- Publication date Sep 14, 2006
- GELCORE LLC
- Michael J. Sackrison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laser separation of encapsulated submount
- Publication number 20060030125
- Publication date Feb 9, 2006
- GELCORE, LLC
- Michael Sackrison
- H01 - BASIC ELECTRIC ELEMENTS

Michael Sackrison

Person

Patents Grantslast 30 patents

Underfill for light emitting device

Wafer level package for very small footprint and low profile white...

Optimized contact design for thermosonic bonding of flip-chip devices

Increased light extraction from a nitride LED

Laser separation of encapsulated submount

Patents Applicationslast 30 patents

LASER LIFT-OFF WITH IMPROVED LIGHT EXTRACTION

Small footprint high power light emitting package with plurality of...

Underfill for light emitting device

Wafer level package for very small footprint and low profile white...

Optimized contact design for thermosonic bonding of flip-chip devices

Laser separation of encapsulated submount

INCREASED LIGHT EXTRACTION FROM A NITRIDE LED

Laser separation of encapsulated submount