Michael T. Boldman

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Garland, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Direct solder bumping of hard to solder substrate
- Patent number 6,015,083
- Issue date Jan 18, 2000
- MicroFab Technologies, Inc.
- Donald J. Hayes
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printhead for liquid metals and method of use
- Patent number 5,772,106
- Issue date Jun 30, 1998
- MicroFab Technologies, Inc.
- Scott D. Ayers
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for dispensing spherical-shaped quantities of...
- Patent number 5,229,016
- Issue date Jul 20, 1993
- MicroFab Technologies, Inc.
- Donald J. Hayes
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR