TREA

Michael Todd Wyant

Follow

Person

  • Dallas, TX, US
People

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    LASER DICING FOR SINGULATION
    • Publication number 20250157858
    • Publication date May 15, 2025
    • TEXAS INSTRUMENTS INCORPORATED
    • Michael Todd Wyant
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND PROCESS WITH CRACK REDUCTION
    • Publication number 20250046733
    • Publication date Feb 6, 2025
    • TEXAS INSTRUMENTS INCORPORATED
    • Jaimal Mallory Willamson
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    POST-LASER DICING WAFER-LEVEL TESTING
    • Publication number 20240332078
    • Publication date Oct 3, 2024
    • TEXAS INSTRUMENTS INCORPORATED
    • Michael T. WYANT
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHODS OF SEPARATING SEMICONDUCTOR DIES
    • Publication number 20240071828
    • Publication date Feb 29, 2024
    • TEXAS INSTRUMENTS INCORPORATED
    • Michael Todd Wyant
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COATED SEMICONDUCTOR DIES
    • Publication number 20240055313
    • Publication date Feb 15, 2024
    • TEXAS INSTRUMENTS INCORPORATED
    • Michael Todd WYANT
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LASER ABLATION FOR DIE SEPARATION TO REDUCE LASER SPLASH AND ELECTR...
    • Publication number 20230387036
    • Publication date Nov 30, 2023
    • TEXAS INSTRUMENTS INCORPORATED
    • Michael Todd Wyant
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    EFFICIENT REMOVAL OF STREET TEST DEVICES DURING WAFER DICING
    • Publication number 20230274978
    • Publication date Aug 31, 2023
    • TEXAS INSTRUMENTS INCORPORATED
    • Michael Todd WYANT
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FRONT SIDE LASER-BASED WAFER DICING
    • Publication number 20230260839
    • Publication date Aug 17, 2023
    • TEXAS INSTRUMENTS INCORPORATED
    • MATTHEW JOHN SHERBIN
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    INTEGRATED CIRCUIT HAVING IMPROVED ASML ALIGNMENT MARKS
    • Publication number 20230134102
    • Publication date May 4, 2023
    • TEXAS INSTRUMENTS INCORPORATED
    • Stephen Arlon Meisner
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LASER DICING FOR SINGULATION
    • Publication number 20230040267
    • Publication date Feb 9, 2023
    • TEXAS INSTRUMENTS INCORPORATED
    • Michael Todd Wyant
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    HYPERBARIC SAW FOR SAWING PACKAGED DEVICES
    • Publication number 20220208571
    • Publication date Jun 30, 2022
    • TEXAS INSTRUMENTS INCORPORATED
    • Byron Harry Gibbs
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COATED SEMICONDUCTOR DIES
    • Publication number 20220068744
    • Publication date Mar 3, 2022
    • TEXAS INSTRUMENTS INCORPORATED
    • Michael Todd WYANT
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INTEGRATED CIRCUIT WITH METAL STOP RING OUTSIDE THE SCRIBE SEAL
    • Publication number 20210210440
    • Publication date Jul 8, 2021
    • TEXAS INSTRUMENTS INCORPORATED
    • Christopher Daniel Manack
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SUBRING FOR SEMICONDUCTOR DIES
    • Publication number 20210183683
    • Publication date Jun 17, 2021
    • TEXAS INSTRUMENTS INCORPORATED
    • Matthew John Sherbin
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE WITH LEADFRAME HAVING PRE-SINGULATED LEADS OR...
    • Publication number 20200266133
    • Publication date Aug 20, 2020
    • TEXAS INSTRUMENTS INCORPORATED
    • Bradley Andrew Glasscock
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FRONT SIDE LASER-BASED WAFER DICING
    • Publication number 20200176314
    • Publication date Jun 4, 2020
    • TEXAS INSTRUMENTS INCORPORATED
    • MATTHEW JOHN SHERBIN
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SUBRING FOR SEMICONDUCTOR DIES
    • Publication number 20200075386
    • Publication date Mar 5, 2020
    • TEXAS INSTRUMENTS INCORPORATED
    • Matthew John Sherbin
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LASER DICING FOR SINGULATION
    • Publication number 20200051860
    • Publication date Feb 13, 2020
    • TEXAS INSTRUMENTS INCORPORATED
    • Michael Todd Wyant
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DIE MATRIX EXPANDER WITH PARTITIONED SUBRING
    • Publication number 20200027772
    • Publication date Jan 23, 2020
    • TEXAS INSTRUMENTS INCORPORATED
    • MATTHEW JOHN SHERBIN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SELECTIVE HEAT SEAL WAFER COVER TAPE (HAS TAPE)
    • Publication number 20150083641
    • Publication date Mar 26, 2015
    • TEXAS INSTRUMENTS INCORPORATED
    • Michael T. Wyant
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Stacked Semiconductor Package
    • Publication number 20130256852
    • Publication date Oct 3, 2013
    • TEXAS INSTRUMENTS INCORPORATED
    • Michael Todd Wyant
    • H01 - BASIC ELECTRIC ELEMENTS