Michael W. Newman

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Microelectronic package and method of cooling same
- Patent number 7,592,697
- Issue date Sep 22, 2009
- Intel Corporation
- Leonel R. Arana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit die containing particle-filled through-silicon m...
- Patent number 7,528,006
- Issue date May 5, 2009
- Intel Corporation
- Leonel Arana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming through-silicon vias with stress buffer collars a...
- Patent number 7,402,515
- Issue date Jul 22, 2008
- Intel Corporation
- Leonel R. Arana
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Integrated circuit die containing particale-filled through-silicon...
- Publication number 20100193952
- Publication date Aug 5, 2010
- Leonel Arana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGE AND METHOD OF COOLING SAME
- Publication number 20090057881
- Publication date Mar 5, 2009
- Leonel R. Arana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming through-silicon vias with stress buffer collars a...
- Publication number 20080251932
- Publication date Oct 16, 2008
- Leonel R. Arana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit die containing particle-filled through-silicon m...
- Publication number 20070001266
- Publication date Jan 4, 2007
- Leonel Arana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming through-silicon vias with stress buffer collars a...
- Publication number 20060290002
- Publication date Dec 28, 2006
- Leonel R. Arana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of supporting microelectronic wafer during backside processing
- Publication number 20060286768
- Publication date Dec 21, 2006
- Intel Corporation
- Leonel R. Arana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fill for large volume vias
- Publication number 20050248002
- Publication date Nov 10, 2005
- Michael Newman
- H01 - BASIC ELECTRIC ELEMENTS

Michael W. Newman

Person

Patents Grantslast 30 patents

Microelectronic package and method of cooling same

Integrated circuit die containing particle-filled through-silicon m...

Method of forming through-silicon vias with stress buffer collars a...

Patents Applicationslast 30 patents

Integrated circuit die containing particale-filled through-silicon...

MICROELECTRONIC PACKAGE AND METHOD OF COOLING SAME

Method of forming through-silicon vias with stress buffer collars a...

Integrated circuit die containing particle-filled through-silicon m...

Method of forming through-silicon vias with stress buffer collars a...

Method of supporting microelectronic wafer during backside processing

Fill for large volume vias