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Michael W. Osborne
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Clinton, MA, US
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Patents Grants
last 30 patents
Information
Patent Grant
System apparatus and method for enhancing electrical clamping of su...
Patent number
11,875,967
Issue date
Jan 16, 2024
Applied Materials, Inc.
Qin Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
System apparatus and method for enhancing electrical clamping of su...
Patent number
11,538,714
Issue date
Dec 27, 2022
Applied Materials, Inc.
Qin Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
System apparatus and method for enhancing electrical clamping of su...
Patent number
11,315,819
Issue date
Apr 26, 2022
Applied Materials, Inc.
Qin Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
System and method for reduced workpiece adhesion due to electrostat...
Patent number
10,825,645
Issue date
Nov 3, 2020
Varian Semiconductor Equipment Associates, Inc.
Eric D. Wilson
G01 - MEASURING TESTING
Information
Patent Grant
Method for implantation of semiconductor wafers having high bulk re...
Patent number
9,824,857
Issue date
Nov 21, 2017
Varian Semiconductor Equipment Associates, Inc.
Michael W. Osborne
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SYSTEM APPARATUS AND METHOD FOR ENHANCING ELECTRICAL CLAMPING OF SU...
Publication number
20210366689
Publication date
Nov 25, 2021
Applied Materials, Inc.
Qin Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEM APPARATUS AND METHOD FOR ENHANCING ELECTRICAL CLAMPING OF SU...
Publication number
20210366759
Publication date
Nov 25, 2021
Applied Materials, Inc.
Qin Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEM APPARATUS AND METHOD FOR ENHANCING ELECTRICAL CLAMPING OF SU...
Publication number
20210366757
Publication date
Nov 25, 2021
Applied Materials, Inc.
Qin Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEM APPARATUS AND METHOD FOR ENHANCING ELECTRICAL CLAMPING OF SU...
Publication number
20210366756
Publication date
Nov 25, 2021
Applied Materials, Inc.
Qin Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
System And Method For Reduced Workpiece Adhesion Due To Electrostat...
Publication number
20190057835
Publication date
Feb 21, 2019
Varian Semiconductor Equipment Associates, Inc.
Eric D. Wilson
G01 - MEASURING TESTING
Information
Patent Application
METHOD FOR IMPLANTATION OF SEMICONDUCTOR WAFERS HAVING HIGH BULK RE...
Publication number
20170207063
Publication date
Jul 20, 2017
Michael W. Osborne
H01 - BASIC ELECTRIC ELEMENTS