Michael Wood

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Atomic layer etch of tungsten for enhanced tungsten deposition fill
- Patent number 11,069,535
- Issue date Jul 20, 2021
- Lam Research Corporation
- Chiukin Steven Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic layer etching of tungsten for enhanced tungsten deposition fill
- Patent number 9,972,504
- Issue date May 15, 2018
- Lam Research Corporation
- Chiukin Steven Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gap fill integration
- Patent number 8,728,958
- Issue date May 20, 2014
- Novellus Systems, Inc.
- Kaihan Ashtiani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Static, dynamic and intelligent VRF routing for services traffic
- Patent number 8,457,117
- Issue date Jun 4, 2013
- Cisco Technology, Inc.
- Michael J. Wood
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Static, dynamic and intelligent VRF routing for services traffic
- Patent number 7,792,097
- Issue date Sep 7, 2010
- Cisco Technology, Inc.
- Michael J. Wood
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Configurable basic rate interface
- Patent number 6,965,609
- Issue date Nov 15, 2005
- Cisco Technology, Inc.
- Michael Joseph Wood
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method and apparatus for process monitoring
- Patent number 6,936,842
- Issue date Aug 30, 2005
- Applied Materials, Inc.
- Suraj Rengarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for electro chemical plating using backside el...
- Patent number 6,802,947
- Issue date Oct 12, 2004
- Applied Materials, Inc.
- Donald J. K. Olgado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post metal barrier/adhesion film
- Patent number 6,753,248
- Issue date Jun 22, 2004
- Applied Materials, Inc.
- Michael Wood
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ATOMIC LAYER ETCHING OF TUNGSTEN FOR ENHANCED TUNGSTEN DEPOSITION FILL
- Publication number 20220115244
- Publication date Apr 14, 2022
- LAM RESEARCH CORPORATION
- Chiukin Steven LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LAYER ETCHING OF TUNGSTEN FOR ENHANCED TUNGSTEN DEPOSITION FILL
- Publication number 20210305059
- Publication date Sep 30, 2021
- LAM RESEARCH CORPORATION
- Chiukin Steven Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LAYER ETCH OF TUNGSTEN FOR ENHANCED TUNGSTEN DEPOSITION FILL
- Publication number 20200286743
- Publication date Sep 10, 2020
- LAM RESEARCH CORPORATION
- Chiukin Steven Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LAYER ETCH OF TUNGSTEN FOR ENHANCED TUNGSTEN DEPOSITION FILL
- Publication number 20180240682
- Publication date Aug 23, 2018
- LAM RESEARCH CORPORATION
- Chiukin Steven Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LAYER ETCHING OF TUNGSTEN FOR ENHANCED TUNGSTEN DEPOSITION FILL
- Publication number 20170040214
- Publication date Feb 9, 2017
- LAM RESEARCH CORPORATION
- Chiukin Steven Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR DIELECTRIC DEPOSITION
- Publication number 20140302689
- Publication date Oct 9, 2014
- Novellus Systems, Inc.
- Kaihan Ashtiani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL GAP FILL INTEGRATION
- Publication number 20110151678
- Publication date Jun 23, 2011
- Kaihan Ashtiani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR ELECTRO CHEMICAL PLATING USING BACKSID ELE...
- Publication number 20040173454
- Publication date Sep 9, 2004
- APPLIED MATERIALS, INC.
- Donald J.K. Olgado
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Apparatus and method for electropolishing a substrate in an electro...
- Publication number 20030201170
- Publication date Oct 30, 2003
- APPLIED MATERIALS, INC.
- Srinivas Gandikota
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method and apparatus for process monitoring
- Publication number 20030032207
- Publication date Feb 13, 2003
- Suraj Rengarajan
- H01 - BASIC ELECTRIC ELEMENTS

Michael Wood

Person

Patents Grantslast 30 patents

Atomic layer etch of tungsten for enhanced tungsten deposition fill

Atomic layer etching of tungsten for enhanced tungsten deposition fill

Gap fill integration

Static, dynamic and intelligent VRF routing for services traffic

Static, dynamic and intelligent VRF routing for services traffic

Configurable basic rate interface

Method and apparatus for process monitoring

Apparatus and method for electro chemical plating using backside el...

Post metal barrier/adhesion film

Patents Applicationslast 30 patents

ATOMIC LAYER ETCHING OF TUNGSTEN FOR ENHANCED TUNGSTEN DEPOSITION FILL

ATOMIC LAYER ETCHING OF TUNGSTEN FOR ENHANCED TUNGSTEN DEPOSITION FILL

ATOMIC LAYER ETCH OF TUNGSTEN FOR ENHANCED TUNGSTEN DEPOSITION FILL

ATOMIC LAYER ETCH OF TUNGSTEN FOR ENHANCED TUNGSTEN DEPOSITION FILL

ATOMIC LAYER ETCHING OF TUNGSTEN FOR ENHANCED TUNGSTEN DEPOSITION FILL

METHODS AND APPARATUS FOR DIELECTRIC DEPOSITION

NOVEL GAP FILL INTEGRATION

APPARATUS AND METHOD FOR ELECTRO CHEMICAL PLATING USING BACKSID ELE...

Apparatus and method for electropolishing a substrate in an electro...

Method and apparatus for process monitoring