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Michael Yingling

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  • Binghamton, NY, US
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Patents Grantslast 30 patents

  • Information Patent Grant

    Modular die handling system
    • Patent number 11,164,765
    • Issue date Nov 2, 2021
    • Universal Instruments Corporation
    • Michael Murray Yingling
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    MODULAR DIE HANDLING SYSTEM
    • Publication number 20190252220
    • Publication date Aug 15, 2019
    • Michael Murray Yingling
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COMPONENT PLACEMENT PROCESS AND APPARATUS
    • Publication number 20120218402
    • Publication date Aug 30, 2012
    • UNIVERSAL INSTRUMENTS CORPORATION
    • Koenraad A. Gieskes
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR