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Michael Zernack
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Pinneberg, DE
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last 30 patents
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Patent Grant
Die preparation for wafer-level chip scale package (WLCSP)
Patent number
8,895,363
Issue date
Nov 25, 2014
NXP B.V.
Hartmut Buenning
H01 - BASIC ELECTRIC ELEMENTS
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last 30 patents
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Patent Application
Die Preparation for Wafer-Level Chip Scale Package (WLCSP)
Publication number
20140264768
Publication date
Sep 18, 2014
NXP B.V.
Hartmut Buenning
H01 - BASIC ELECTRIC ELEMENTS