Michael ZIESMANN

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Hamburg, DE

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor wafer and method of producing the same
- Patent number 9,754,832
- Issue date Sep 5, 2017
- NXP B.V.
- Florian Schmitt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tamper resistant IC
- Patent number 9,509,306
- Issue date Nov 29, 2016
- NXP B.V.
- Soenke Ostertun
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Back-side contact formation
- Patent number 8,860,230
- Issue date Oct 14, 2014
- NXP B.V.
- Florian Schmitt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back-side contact formation
- Patent number 8,551,882
- Issue date Oct 8, 2013
- NXP B.V.
- Florian Schmitt
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BACK-SIDE CONTACT FORMATION
- Publication number 20130320506
- Publication date Dec 5, 2013
- NXP B.V.
- Florian SCHMITT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TAMPER RESISTANT IC
- Publication number 20130307578
- Publication date Nov 21, 2013
- NXP B.V.
- Soenke Ostertun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK-SIDE CONTACT FORMATION
- Publication number 20120319250
- Publication date Dec 20, 2012
- Florian Schmitt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor wafer and method of producing the same
- Publication number 20120306056
- Publication date Dec 6, 2012
- NXP B.V.
- Florian Schmitt
- H01 - BASIC ELECTRIC ELEMENTS