Michal Danek

Person

Cupertino, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Metal deposition
- Patent number 12,203,168
- Issue date Jan 21, 2025
- Lam Research Corporation
- Ravi Vellanki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Deposition of tungsten on molybdenum templates
- Patent number 12,148,623
- Issue date Nov 19, 2024
- Lam Research Corporation
- Patrick A. van Cleemput
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Molybdenum deposition
- Patent number 12,074,029
- Issue date Aug 27, 2024
- Lam Research Corporation
- Patrick A. Van Cleemput
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Feature fill with nucleation inhibition
- Patent number 11,901,227
- Issue date Feb 13, 2024
- Lam Research Corporation
- Anand Chandrashekar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Determination of recipes for manufacturing semiconductor devices
- Patent number 11,836,429
- Issue date Dec 5, 2023
- Lam Research Corporation
- Kapil Umesh Sawlani
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Systems and methods for homogenous intermixing of precursors in all...
- Patent number 11,827,976
- Issue date Nov 28, 2023
- Lam Research Corporation
- Ilanit Fisher
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Tungsten feature fill with nucleation inhibition
- Patent number 11,410,883
- Issue date Aug 9, 2022
- Novellus Systems, Inc.
- Anand Chandrashekar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for preventing line bending during metal fill process
- Patent number 11,355,345
- Issue date Jun 7, 2022
- Lam Research Corporation
- Adam Jandl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal fill process for three-dimensional vertical NAND wordline
- Patent number 11,348,795
- Issue date May 31, 2022
- Lam Research Corporation
- Lawrence Schloss
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Defect classification and source analysis for semiconductor equipment
- Patent number 11,263,737
- Issue date Mar 1, 2022
- Lam Research Corporation
- Kapil Sawlani
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Tungsten feature fill
- Patent number 11,075,115
- Issue date Jul 27, 2021
- Novellus Systems, Inc.
- Anand Chandrashekar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic layer etch of tungsten for enhanced tungsten deposition fill
- Patent number 11,069,535
- Issue date Jul 20, 2021
- Lam Research Corporation
- Chiukin Steven Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fill process optimization using feature scale modeling
- Patent number 10,977,405
- Issue date Apr 13, 2021
- Lam Research Corporation
- Michael Bowes
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Feature fill with multi-stage nucleation inhibition
- Patent number 10,916,434
- Issue date Feb 9, 2021
- Lam Research Corporation
- Deqi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-situ chamber clean end point detection systems and methods using...
- Patent number 10,895,539
- Issue date Jan 19, 2021
- Lam Research Corporation
- Kapil Sawlani
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Low resistivity films containing molybdenum
- Patent number 10,777,453
- Issue date Sep 15, 2020
- Lam Research Corporation
- Shruti Vivek Thombare
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Depositing ruthenium layers in interconnect metallization
- Patent number 10,731,250
- Issue date Aug 4, 2020
- Lam Research Corporation
- Do Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Feature fill with nucleation inhibition
- Patent number 10,580,695
- Issue date Mar 3, 2020
- Lam Research Corporation
- Anand Chandrashekar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Feature fill with multi-stage nucleation inhibition
- Patent number 10,580,654
- Issue date Mar 3, 2020
- Lam Research Corporation
- Deqi Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for preventing line bending during metal fill process
- Patent number 10,573,522
- Issue date Feb 25, 2020
- Lam Research Corporation
- Adam Jandl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming low resistivity fluorine free tungsten film without nucleation
- Patent number 10,546,751
- Issue date Jan 28, 2020
- Lam Research Corporation
- Hanna Bamnolker
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Tungsten for wordline applications
- Patent number 10,529,722
- Issue date Jan 7, 2020
- Lam Research Corporation
- Michal Danek
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Low resistivity films containing molybdenum
- Patent number 10,510,590
- Issue date Dec 17, 2019
- Lam Research Corporation
- Shruti Vivek Thombare
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manganese barrier and adhesion layers for cobalt
- Patent number 10,438,847
- Issue date Oct 8, 2019
- Lam Research Corporation
- Chiukin Steven Lai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Tungsten feature fill with nucleation inhibition
- Patent number 10,256,142
- Issue date Apr 9, 2019
- Novellus Systems, Inc.
- Anand Chandrashekar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Feature fill with multi-stage nucleation inhibition
- Patent number 10,170,320
- Issue date Jan 1, 2019
- Lam Research Corporation
- Deqi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated direct dielectric and metal deposition
- Patent number 10,128,116
- Issue date Nov 13, 2018
- Lam Research Corporation
- William T. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tungsten feature fill
- Patent number 10,103,058
- Issue date Oct 16, 2018
- Novellus Systems, Inc.
- Anand Chandrashekar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vapor delivery method and apparatus for solid and liquid precursors
- Patent number 10,087,523
- Issue date Oct 2, 2018
- Lam Research Corporation
- Joshua Collins
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Feature fill with nucleation inhibition
- Patent number 9,997,405
- Issue date Jun 12, 2018
- Lam Research Corporation
- Anand Chandrashekar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
MOLYBDENUM DEPOSITION
- Publication number 20250029840
- Publication date Jan 23, 2025
- LAM RESEARCH CORPORATION
- Patrick A. VAN CLEEMPUT
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
GENERATING DIGITAL TWINS OF SEMICONDUCTOR MANUFACTURING EQUIPMENT
- Publication number 20240378347
- Publication date Nov 14, 2024
- LAM RESEARCH CORPORATION
- Sassan Roham
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LOW RESISTIVITY FILMS CONTAINING MOLYBDENUM
- Publication number 20240297075
- Publication date Sep 5, 2024
- LAM RESEARCH CORPORATION
- Shruti Vivek THOMBARE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
IMAGE ANALYSIS OF PLASMA CONDITIONS
- Publication number 20240234112
- Publication date Jul 11, 2024
- LAM RESEARCH CORPORATION
- Michal Danek
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DETERMINATION OF RECIPES FOR MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20240095432
- Publication date Mar 21, 2024
- LAM RESEARCH CORPORATION
- Kapil Umesh Sawlani
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEMS AND METHODS FOR HOMOGENOUS INTERMIXING OF PRECURSORS IN ALL...
- Publication number 20240084443
- Publication date Mar 14, 2024
- LAM RESEARCH CORPORATION
- Ilanit FISHER
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PREDICTIVE MAINTENANCE FOR SEMICONDUCTOR MANUFACTURING EQUIPMENT
- Publication number 20230400847
- Publication date Dec 14, 2023
- LAM RESEARCH CORPORATION
- Jian Guo
- G05 - CONTROLLING REGULATING
Information Patent Application
SELF-LIMITING GROWTH
- Publication number 20230290680
- Publication date Sep 14, 2023
- LAM RESEARCH CORPORATION
- Joshua Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PERFORMANCE PREDICTORS FOR SEMICONDUCTOR-MANUFACTURING PROCESSES
- Publication number 20230049157
- Publication date Feb 16, 2023
- LAM RESEARCH CORPORATION
- Kapil Umesh Sawlani
- G05 - CONTROLLING REGULATING
Information Patent Application
TUNGSTEN FEATURE FILL WITH NUCLEATION INHIBITION
- Publication number 20230041794
- Publication date Feb 9, 2023
- Novellus Systems, Inc.
- Anand Chandrashekar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DETERMINATION OF RECIPE FOR MANUFACTURING SEMICONDUCTOR
- Publication number 20220374572
- Publication date Nov 24, 2022
- LAM RESEARCH CORPORATION
- Kapil Umesh Sawlani
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MOLYBDENUM TEMPLATES FOR TUNGSTEN
- Publication number 20220359211
- Publication date Nov 10, 2022
- LAM RESEARCH CORPORATION
- Patrick A. VAN CLEEMPUT
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METAL DEPOSITION
- Publication number 20220290300
- Publication date Sep 15, 2022
- LAM RESEARCH CORPORATION
- Ravi Vellanki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DEFECT CLASSIFICATION AND SOURCE ANALYSIS FOR SEMICONDUCTOR EQUIPMENT
- Publication number 20220270237
- Publication date Aug 25, 2022
- LAM RESEARCH CORPORATION
- Kapil Sawlani
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR PREVENTING LINE BENDING DURING METAL FILL PROCESS
- Publication number 20220262640
- Publication date Aug 18, 2022
- LAM RESEARCH CORPORATION
- Adam Jandl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NUCLEATION-FREE TUNGSTEN DEPOSITION
- Publication number 20220254685
- Publication date Aug 11, 2022
- LAM RESEARCH CORPORATION
- Sema ERMEZ
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LOW RESISTIVITY FILMS CONTAINING MOLYBDENUM
- Publication number 20220223471
- Publication date Jul 14, 2022
- LAM RESEARCH CORPORATION
- Shruti Vivek THOMBARE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ATOMIC LAYER ETCHING OF TUNGSTEN FOR ENHANCED TUNGSTEN DEPOSITION FILL
- Publication number 20220115244
- Publication date Apr 14, 2022
- LAM RESEARCH CORPORATION
- Chiukin Steven LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FEATURE FILL WITH NUCLEATION INHIBITION
- Publication number 20220102208
- Publication date Mar 31, 2022
- LAM RESEARCH CORPORATION
- Anand Chandrashekar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MOLYBDENUM TEMPLATES FOR TUNGSTEN
- Publication number 20220013365
- Publication date Jan 13, 2022
- LAM RESEARCH CORPORATION
- Patrick A. van Cleemput
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TUNGSTEN FEATURE FILL
- Publication number 20210327754
- Publication date Oct 21, 2021
- Novellus Systems, Inc.
- Anand Chandrashekar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LAYER ETCHING OF TUNGSTEN FOR ENHANCED TUNGSTEN DEPOSITION FILL
- Publication number 20210305059
- Publication date Sep 30, 2021
- LAM RESEARCH CORPORATION
- Chiukin Steven Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR HOMOGENOUS INTERMIXING OF PRECURSORS IN ALL...
- Publication number 20200407842
- Publication date Dec 31, 2020
- LAM RESEARCH CORPORATION
- Ilanit FISHER
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELF-LIMITING GROWTH
- Publication number 20200402846
- Publication date Dec 24, 2020
- LAM RESEARCH CORPORATION
- Joshua Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW RESISTIVITY FILMS CONTAINING MOLYBDENUM
- Publication number 20200365456
- Publication date Nov 19, 2020
- LAM RESEARCH CORPORATION
- Shruti Vivek Thombare
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LAYER ETCH OF TUNGSTEN FOR ENHANCED TUNGSTEN DEPOSITION FILL
- Publication number 20200286743
- Publication date Sep 10, 2020
- LAM RESEARCH CORPORATION
- Chiukin Steven Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILL PROCESS OPTIMIZATION USING FEATURE SCALE MODELING
- Publication number 20200242209
- Publication date Jul 30, 2020
- LAM RESEARCH CORPORATION
- Michael Bowes
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DEFECT CLASSIFICATION AND SOURCE ANALYSIS FOR SEMICONDUCTOR EQUIPMENT
- Publication number 20200226742
- Publication date Jul 16, 2020
- LAM RESEARCH CORPORATION
- Kapil Sawlani
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METAL FILL PROCESS FOR THREE-DIMENSIONAL VERTICAL NAND WORDLINE
- Publication number 20200211853
- Publication date Jul 2, 2020
- LAM RESEARCH CORPORATION
- Lawrence Schloss
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FEATURE FILL WITH MULTI-STAGE NUCLEATION INHIBITION
- Publication number 20200185225
- Publication date Jun 11, 2020
- LAM RESEARCH CORPORATION
- Deqi Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Michal Danek

Person

Patents Grantslast 30 patents

Metal deposition

Deposition of tungsten on molybdenum templates

Molybdenum deposition

Feature fill with nucleation inhibition

Determination of recipes for manufacturing semiconductor devices

Systems and methods for homogenous intermixing of precursors in all...

Tungsten feature fill with nucleation inhibition

Method for preventing line bending during metal fill process

Metal fill process for three-dimensional vertical NAND wordline

Defect classification and source analysis for semiconductor equipment

Tungsten feature fill

Atomic layer etch of tungsten for enhanced tungsten deposition fill

Fill process optimization using feature scale modeling

Feature fill with multi-stage nucleation inhibition

In-situ chamber clean end point detection systems and methods using...

Low resistivity films containing molybdenum

Depositing ruthenium layers in interconnect metallization

Feature fill with nucleation inhibition

Feature fill with multi-stage nucleation inhibition

Method for preventing line bending during metal fill process

Forming low resistivity fluorine free tungsten film without nucleation

Tungsten for wordline applications

Low resistivity films containing molybdenum

Manganese barrier and adhesion layers for cobalt

Tungsten feature fill with nucleation inhibition

Feature fill with multi-stage nucleation inhibition

Integrated direct dielectric and metal deposition

Tungsten feature fill

Vapor delivery method and apparatus for solid and liquid precursors

Feature fill with nucleation inhibition

Patents Applicationslast 30 patents

MOLYBDENUM DEPOSITION

GENERATING DIGITAL TWINS OF SEMICONDUCTOR MANUFACTURING EQUIPMENT

LOW RESISTIVITY FILMS CONTAINING MOLYBDENUM

IMAGE ANALYSIS OF PLASMA CONDITIONS

DETERMINATION OF RECIPES FOR MANUFACTURING SEMICONDUCTOR DEVICES

SYSTEMS AND METHODS FOR HOMOGENOUS INTERMIXING OF PRECURSORS IN ALL...

PREDICTIVE MAINTENANCE FOR SEMICONDUCTOR MANUFACTURING EQUIPMENT

SELF-LIMITING GROWTH

PERFORMANCE PREDICTORS FOR SEMICONDUCTOR-MANUFACTURING PROCESSES

TUNGSTEN FEATURE FILL WITH NUCLEATION INHIBITION

DETERMINATION OF RECIPE FOR MANUFACTURING SEMICONDUCTOR

MOLYBDENUM TEMPLATES FOR TUNGSTEN

METAL DEPOSITION

DEFECT CLASSIFICATION AND SOURCE ANALYSIS FOR SEMICONDUCTOR EQUIPMENT

METHOD FOR PREVENTING LINE BENDING DURING METAL FILL PROCESS

NUCLEATION-FREE TUNGSTEN DEPOSITION

LOW RESISTIVITY FILMS CONTAINING MOLYBDENUM

ATOMIC LAYER ETCHING OF TUNGSTEN FOR ENHANCED TUNGSTEN DEPOSITION FILL

FEATURE FILL WITH NUCLEATION INHIBITION

MOLYBDENUM TEMPLATES FOR TUNGSTEN

TUNGSTEN FEATURE FILL

ATOMIC LAYER ETCHING OF TUNGSTEN FOR ENHANCED TUNGSTEN DEPOSITION FILL

SYSTEMS AND METHODS FOR HOMOGENOUS INTERMIXING OF PRECURSORS IN ALL...

SELF-LIMITING GROWTH

LOW RESISTIVITY FILMS CONTAINING MOLYBDENUM

ATOMIC LAYER ETCH OF TUNGSTEN FOR ENHANCED TUNGSTEN DEPOSITION FILL

FILL PROCESS OPTIMIZATION USING FEATURE SCALE MODELING

DEFECT CLASSIFICATION AND SOURCE ANALYSIS FOR SEMICONDUCTOR EQUIPMENT

METAL FILL PROCESS FOR THREE-DIMENSIONAL VERTICAL NAND WORDLINE

FEATURE FILL WITH MULTI-STAGE NUCLEATION INHIBITION