Michel Koopmans

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Thermal pads between stacked semiconductor dies and associated syst...
- Patent number 12,033,980
- Issue date Jul 9, 2024
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays, and methods of forming memory arrays
- Patent number 11,004,494
- Issue date May 11, 2021
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal pads between stacked semiconductor dies and associated syst...
- Patent number 10,651,155
- Issue date May 12, 2020
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device test apparatuses comprising at least one test...
- Patent number 10,481,200
- Issue date Nov 19, 2019
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- G01 - MEASURING TESTING
Information Patent Grant
Stacked semiconductor die assemblies with improved thermal performa...
- Patent number 10,461,059
- Issue date Oct 29, 2019
- Micron Technology, Inc.
- Michel Koopmans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses and methods for forming die stacks
- Patent number 10,269,782
- Issue date Apr 23, 2019
- Micron Technology, Inc.
- Michel Koopmans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays, and methods of forming memory arrays
- Patent number 10,242,726
- Issue date Mar 26, 2019
- Micron Technology, Inc.
- Sanh D. Tang
- G11 - INFORMATION STORAGE
Information Patent Grant
Memory arrays, and methods of forming memory arrays
- Patent number 10,153,027
- Issue date Dec 11, 2018
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of testing semiconductor devices comprising a die stack hav...
- Patent number 10,126,357
- Issue date Nov 13, 2018
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- G01 - MEASURING TESTING
Information Patent Grant
Thermal pads between stacked semiconductor dies and associated syst...
- Patent number 10,096,579
- Issue date Oct 9, 2018
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays
- Patent number 10,083,734
- Issue date Sep 25, 2018
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses and methods for forming die stacks
- Patent number 10,062,679
- Issue date Aug 28, 2018
- Micron Technology, Inc.
- Michel Koopmans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses and methods for forming die stacks
- Patent number 9,881,910
- Issue date Jan 30, 2018
- Micron Technology, Inc.
- Michel Koopmans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die assemblies with thermal spacers and assoc...
- Patent number 9,818,625
- Issue date Nov 14, 2017
- Micron Technology, Inc.
- Jian Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal pads between stacked semiconductor dies and associated syst...
- Patent number 9,768,147
- Issue date Sep 19, 2017
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device test apparatuses
- Patent number 9,733,304
- Issue date Aug 15, 2017
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- G01 - MEASURING TESTING
Information Patent Grant
Methods of fabricating semiconductor die assemblies
- Patent number 9,711,494
- Issue date Jul 18, 2017
- Micron Technology, Inc.
- Luke G. England
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses and methods for forming die stacks
- Patent number 9,659,917
- Issue date May 23, 2017
- Micron Technology, Inc.
- Michel Koopmans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die assemblies and semiconductor devices including same
- Patent number 9,379,091
- Issue date Jun 28, 2016
- Micron Technology, Inc.
- Luke G. England
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming semiconductor device packages with photoimageab...
- Patent number 9,362,143
- Issue date Jun 7, 2016
- Micron Technology, Inc.
- Yangyang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die assemblies with thermal spacers and assoc...
- Patent number 9,287,240
- Issue date Mar 15, 2016
- Micron Technology, Inc.
- Jian Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die assemblies with improved thermal performa...
- Patent number 9,269,700
- Issue date Feb 23, 2016
- Micron Technology, Inc.
- Michel Koopmans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die assemblies, semiconductor devices including same,...
- Patent number 8,937,309
- Issue date Jan 20, 2015
- Micron Technology, Inc.
- Luke G. England
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die assemblies, semiconductor devices including same,...
- Patent number 8,828,798
- Issue date Sep 9, 2014
- Micron Technology, Inc.
- Luke G. England
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die assemblies, semiconductor devices including same,...
- Patent number 8,552,567
- Issue date Oct 8, 2013
- Micron Technology, Inc.
- Luke G. England
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for depositing and reflowing solder paste on a...
- Patent number 7,637,412
- Issue date Dec 29, 2009
- Micron Technology, Inc.
- Michel Koopmans
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for depositing and reflowing solder paste on a...
- Patent number 7,347,348
- Issue date Mar 25, 2008
- Micron Technology, Inc.
- Michel Koopmans
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for attaching semiconductor components to a substrate using...
- Patent number 6,943,094
- Issue date Sep 13, 2005
- Micron Technology, Inc.
- Michel Koopmans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component installation, removal, and replacement apparatus and method
- Patent number 6,911,624
- Issue date Jun 28, 2005
- Micron Technology, Inc.
- Michel Koopmans
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bumping technology in stacked die configurations
- Patent number 6,847,105
- Issue date Jan 25, 2005
- Micron Technology, Inc.
- Michel Koopmans
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THERMAL PADS BETWEEN STACKED SEMICONDUCTOR DIES AND ASSOCIATED SYST...
- Publication number 20240347511
- Publication date Oct 17, 2024
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL PADS BETWEEN STACKED SEMICONDUCTOR DIES AND ASSOCIATED SYST...
- Publication number 20200411482
- Publication date Dec 31, 2020
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays, and Methods of Forming Memory Arrays
- Publication number 20190172517
- Publication date Jun 6, 2019
- Micron Technology, Inc.
- Sanh D. Tang
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE TEST APPARATUSES
- Publication number 20190072608
- Publication date Mar 7, 2019
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- G01 - MEASURING TESTING
Information Patent Application
THERMAL PADS BETWEEN STACKED SEMICONDUCTOR DIES AND ASSOCIATED SYST...
- Publication number 20190006323
- Publication date Jan 3, 2019
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES AND METHODS FOR FORMING DIE STACKS
- Publication number 20180337166
- Publication date Nov 22, 2018
- Micron Technology, Inc.
- MICHEL KOOPMANS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES AND METHODS FOR FORMING DIE STACKS
- Publication number 20180108645
- Publication date Apr 19, 2018
- Micron Technology, Inc.
- MICHEL KOOPMANS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL PADS BETWEEN STACKED SEMICONDUCTOR DIES AND ASSOCIATED SYST...
- Publication number 20170352645
- Publication date Dec 7, 2017
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF TESTING SEMICONDUCTOR DEVICES
- Publication number 20170336470
- Publication date Nov 23, 2017
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- G01 - MEASURING TESTING
Information Patent Application
APPARATUSES AND METHODS FOR FORMING DIE STACKS
- Publication number 20170221873
- Publication date Aug 3, 2017
- Micron Technology, Inc.
- MICHEL KOOPMANS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES AND METHODS FOR FORMING DIE STACKS
- Publication number 20170170158
- Publication date Jun 15, 2017
- Micron Technology, Inc.
- MICHEL KOOPMANS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH THERMAL SPACERS AND ASSOC...
- Publication number 20160181125
- Publication date Jun 23, 2016
- Micron Technology, Inc.
- Jian Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH IMPROVED THERMAL PERFORMA...
- Publication number 20160141270
- Publication date May 19, 2016
- Micron Technology, Inc.
- Michel Koopmans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR TESTING STACKED DIE ASSEMBLIES, AND RELATED METHODS
- Publication number 20160084905
- Publication date Mar 24, 2016
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- G01 - MEASURING TESTING
Information Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH IMPROVED THERMAL PERFORMA...
- Publication number 20150279828
- Publication date Oct 1, 2015
- Micron Technology, Inc.
- Michel Koopmans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL PADS BETWEEN STACKED SEMICONDUCTOR DIES AND ASSOCIATED SYST...
- Publication number 20150221612
- Publication date Aug 6, 2015
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH THERMAL SPACERS AND ASSOC...
- Publication number 20150170991
- Publication date Jun 18, 2015
- Micron Technology, Inc.
- Jian Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FABRICATING SEMICONDUCTOR DIE ASSEMBLIES
- Publication number 20150132869
- Publication date May 14, 2015
- Micron Technology, Inc.
- Luke G. England
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE ASSEMBLIES AND SEMICONDUCTOR DEVICES INCLUDING SAME
- Publication number 20140353815
- Publication date Dec 4, 2014
- Luke G. England
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE ASSEMBLIES, SEMICONDUCTOR DEVICES INCLUDING SAME,...
- Publication number 20140017823
- Publication date Jan 16, 2014
- Micron Technology, Inc.
- Luke G. England
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING SEMICONDUCTOR DEVICE PACKAGES WITH PHOTOIMAGEAB...
- Publication number 20130299986
- Publication date Nov 14, 2013
- Micron Technology, Inc.
- Yangyang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE ASSEMBLIES, SEMICONDUCTOR DEVICES INCLUDING SAME,...
- Publication number 20130037802
- Publication date Feb 14, 2013
- Micron Technology, Inc.
- Luke G. England
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE ASSEMBLIES, SEMICONDUCTOR DEVICES INCLUDING SAME,...
- Publication number 20130026643
- Publication date Jan 31, 2013
- Micron Technology, Inc.
- Luke G. England
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR DEPOSITING AND REFLOWING SOLDER PASTE ON A...
- Publication number 20080164298
- Publication date Jul 10, 2008
- Micron Technology, Inc.
- Michel Koopmans
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
System for attaching semiconductor components to substrates
- Publication number 20060130974
- Publication date Jun 22, 2006
- Michel Koopmans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for depositing and reflowing solder paste on a...
- Publication number 20050092810
- Publication date May 5, 2005
- Michel Koopmans
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component installation, removal, and replacement apparatus and method
- Publication number 20040035840
- Publication date Feb 26, 2004
- Michel Koopmans
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus and method for depositing and reflowing solder paste on a...
- Publication number 20040035917
- Publication date Feb 26, 2004
- Michel Koopmans
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and system for attaching semiconductor components to a subst...
- Publication number 20030207497
- Publication date Nov 6, 2003
- Michel Koopmans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bumping technology in stacked die configurations
- Publication number 20030057539
- Publication date Mar 27, 2003
- Michel Koopmans
- H01 - BASIC ELECTRIC ELEMENTS

Michel Koopmans

Person

Patents Grantslast 30 patents

Thermal pads between stacked semiconductor dies and associated syst...

Memory arrays, and methods of forming memory arrays

Thermal pads between stacked semiconductor dies and associated syst...

Semiconductor device test apparatuses comprising at least one test...

Stacked semiconductor die assemblies with improved thermal performa...

Apparatuses and methods for forming die stacks

Memory arrays, and methods of forming memory arrays

Memory arrays, and methods of forming memory arrays

Methods of testing semiconductor devices comprising a die stack hav...

Thermal pads between stacked semiconductor dies and associated syst...

Memory arrays

Apparatuses and methods for forming die stacks

Apparatuses and methods for forming die stacks

Stacked semiconductor die assemblies with thermal spacers and assoc...

Thermal pads between stacked semiconductor dies and associated syst...

Semiconductor device test apparatuses

Methods of fabricating semiconductor die assemblies

Apparatuses and methods for forming die stacks

Semiconductor die assemblies and semiconductor devices including same

Methods for forming semiconductor device packages with photoimageab...

Stacked semiconductor die assemblies with thermal spacers and assoc...

Stacked semiconductor die assemblies with improved thermal performa...

Semiconductor die assemblies, semiconductor devices including same,...

Semiconductor die assemblies, semiconductor devices including same,...

Semiconductor die assemblies, semiconductor devices including same,...

Apparatus and method for depositing and reflowing solder paste on a...

Apparatus and method for depositing and reflowing solder paste on a...

Method for attaching semiconductor components to a substrate using...

Component installation, removal, and replacement apparatus and method

Bumping technology in stacked die configurations

Patents Applicationslast 30 patents

THERMAL PADS BETWEEN STACKED SEMICONDUCTOR DIES AND ASSOCIATED SYST...

THERMAL PADS BETWEEN STACKED SEMICONDUCTOR DIES AND ASSOCIATED SYST...

Memory Arrays, and Methods of Forming Memory Arrays

SEMICONDUCTOR DEVICE TEST APPARATUSES

THERMAL PADS BETWEEN STACKED SEMICONDUCTOR DIES AND ASSOCIATED SYST...

APPARATUSES AND METHODS FOR FORMING DIE STACKS

APPARATUSES AND METHODS FOR FORMING DIE STACKS

THERMAL PADS BETWEEN STACKED SEMICONDUCTOR DIES AND ASSOCIATED SYST...

METHODS OF TESTING SEMICONDUCTOR DEVICES

APPARATUSES AND METHODS FOR FORMING DIE STACKS

APPARATUSES AND METHODS FOR FORMING DIE STACKS

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH THERMAL SPACERS AND ASSOC...

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH IMPROVED THERMAL PERFORMA...

APPARATUS FOR TESTING STACKED DIE ASSEMBLIES, AND RELATED METHODS

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH IMPROVED THERMAL PERFORMA...

THERMAL PADS BETWEEN STACKED SEMICONDUCTOR DIES AND ASSOCIATED SYST...

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH THERMAL SPACERS AND ASSOC...

METHODS OF FABRICATING SEMICONDUCTOR DIE ASSEMBLIES

SEMICONDUCTOR DIE ASSEMBLIES AND SEMICONDUCTOR DEVICES INCLUDING SAME

SEMICONDUCTOR DIE ASSEMBLIES, SEMICONDUCTOR DEVICES INCLUDING SAME,...

METHODS FOR FORMING SEMICONDUCTOR DEVICE PACKAGES WITH PHOTOIMAGEAB...

SEMICONDUCTOR DIE ASSEMBLIES, SEMICONDUCTOR DEVICES INCLUDING SAME,...

SEMICONDUCTOR DIE ASSEMBLIES, SEMICONDUCTOR DEVICES INCLUDING SAME,...

APPARATUS AND METHOD FOR DEPOSITING AND REFLOWING SOLDER PASTE ON A...

System for attaching semiconductor components to substrates

Apparatus and method for depositing and reflowing solder paste on a...

Component installation, removal, and replacement apparatus and method

Apparatus and method for depositing and reflowing solder paste on a...

Method and system for attaching semiconductor components to a subst...

Bumping technology in stacked die configurations