Michele Berry

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Encapsulation of pin solder for maintaining accuracy in pin position
- Patent number 7,211,888
- Issue date May 1, 2007
- Intel Corporation
- Michele J. Berry
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal ball attachment of heat dissipation devices
- Patent number 6,992,891
- Issue date Jan 31, 2006
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulation of pin solder for maintaining accuracy in pin position
- Patent number 6,974,765
- Issue date Dec 13, 2005
- Intel Corporation
- Michele J. Berry
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer-level packaging of electronic devices before singulation
- Patent number 6,867,060
- Issue date Mar 15, 2005
- Intel Corporation
- Steve Greathouse
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaging microelectromechanical structures
- Patent number 6,852,926
- Issue date Feb 8, 2005
- Intel Corporation
- Qing Ma
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
Encapsulation of pin solder for maintaining accuracy in pin position
- Publication number 20050275094
- Publication date Dec 15, 2005
- Intel Corporation
- Michele J. Berry
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Packaging microelectromechanical structures
- Publication number 20050062120
- Publication date Mar 24, 2005
- Qing Ma
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Metal ball attachment of heat dissipation devices
- Publication number 20040196634
- Publication date Oct 7, 2004
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer-level packaging of electronic devices before singulation
- Publication number 20040099917
- Publication date May 27, 2004
- Steve Greathouse
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Packaging microelectromechanical structures
- Publication number 20030183407
- Publication date Oct 2, 2003
- Qing Ma
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Packaging microelectromechanical systems
- Publication number 20030183916
- Publication date Oct 2, 2003
- John Heck
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Encapsulation of pin solder for maintaining accuracy in pin position
- Publication number 20030057572
- Publication date Mar 27, 2003
- Intel Corporation
- Michele J. Berry
- H01 - BASIC ELECTRIC ELEMENTS

Michele Berry

Person

Patents Grantslast 30 patents

Encapsulation of pin solder for maintaining accuracy in pin position

Metal ball attachment of heat dissipation devices

Encapsulation of pin solder for maintaining accuracy in pin position

Wafer-level packaging of electronic devices before singulation

Packaging microelectromechanical structures

Patents Applicationslast 30 patents

Encapsulation of pin solder for maintaining accuracy in pin position

Packaging microelectromechanical structures

Metal ball attachment of heat dissipation devices

Wafer-level packaging of electronic devices before singulation

Packaging microelectromechanical structures

Packaging microelectromechanical systems

Encapsulation of pin solder for maintaining accuracy in pin position