Michelle Yejin Kim

Person

San Diego, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit (IC) packages employing a package substrate with...
- Patent number 11,791,320
- Issue date Oct 17, 2023
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) package with stacked die wire bond connecti...
- Patent number 11,676,905
- Issue date Jun 13, 2023
- QUALCOMM Incorporated
- Kuiwon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump pad structure
- Patent number 11,527,498
- Issue date Dec 13, 2022
- QUALCOMM Incorporated
- Kuiwon Kang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE SUBSTRATE HAVING ELECTRONIC COMPONENT MOUNTED IN A CAVITY O...
- Publication number 20240371737
- Publication date Nov 7, 2024
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT PLACED ON CORE OF SUBSTRATE
- Publication number 20240371775
- Publication date Nov 7, 2024
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE(S) FOR AN INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING A MET...
- Publication number 20240355712
- Publication date Oct 24, 2024
- QUALCOMM Incorporated
- Michelle Yejin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE COMPRISING AT LEAST TWO CORE LAYERS
- Publication number 20240321763
- Publication date Sep 26, 2024
- QUALCOMM Incorporated
- Hong Bok WE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE WITH INTERCONNECTS
- Publication number 20240105568
- Publication date Mar 28, 2024
- QUALCOMM Incorporated
- Joan Rey Villarba BUOT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE WITH POST INTERCONNECTS HAVING A PRO...
- Publication number 20240079307
- Publication date Mar 7, 2024
- QUALCOMM Incorporated
- Wei WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH A SUBSTRATE COMPRISING EMBEDDED ESCAPE INTERCONNECTS A...
- Publication number 20230282585
- Publication date Sep 7, 2023
- QUALCOMM Incorporated
- Kuiwon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATES WITH EMBEDDED DIE-SIDE, FACE-UP DEEP TRENCH CAPA...
- Publication number 20230215849
- Publication date Jul 6, 2023
- QUALCOMM Incorporated
- Seongryul Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING A PACKAGE SUBSTRATE WITH...
- Publication number 20230163112
- Publication date May 25, 2023
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING SUPPLEMENTAL METAL LAYER...
- Publication number 20230118028
- Publication date Apr 20, 2023
- QUALCOMM Incorporated
- Michelle Yejin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP PAD STRUCTURE
- Publication number 20220102298
- Publication date Mar 31, 2022
- QUALCOMM Incorporated
- Kuiwon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGE WITH STACKED DIE WIRE BOND CONNECTI...
- Publication number 20220037257
- Publication date Feb 3, 2022
- QUALCOMM Incorporated
- Kuiwon Kang
- H01 - BASIC ELECTRIC ELEMENTS

Michelle Yejin Kim

Person

Patents Grantslast 30 patents

Integrated circuit (IC) packages employing a package substrate with...

Integrated circuit (IC) package with stacked die wire bond connecti...

Bump pad structure

Patents Applicationslast 30 patents

PACKAGE SUBSTRATE HAVING ELECTRONIC COMPONENT MOUNTED IN A CAVITY O...

ELECTRONIC COMPONENT PLACED ON CORE OF SUBSTRATE

SUBSTRATE(S) FOR AN INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING A MET...

PACKAGE SUBSTRATE COMPRISING AT LEAST TWO CORE LAYERS

PACKAGE COMPRISING A SUBSTRATE WITH INTERCONNECTS

PACKAGE COMPRISING A SUBSTRATE WITH POST INTERCONNECTS HAVING A PRO...

PACKAGE WITH A SUBSTRATE COMPRISING EMBEDDED ESCAPE INTERCONNECTS A...

PACKAGE SUBSTRATES WITH EMBEDDED DIE-SIDE, FACE-UP DEEP TRENCH CAPA...

INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING A PACKAGE SUBSTRATE WITH...

INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING SUPPLEMENTAL METAL LAYER...

BUMP PAD STRUCTURE

INTEGRATED CIRCUIT (IC) PACKAGE WITH STACKED DIE WIRE BOND CONNECTI...