Michiaki Hiyoshi

Person

Yokohama, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and a method of manufacturing same
- Patent number 9,076,774
- Issue date Jul 7, 2015
- Hitachi Power Semiconductor Device, Ltd.
- Yukihiro Kumagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module
- Patent number 9,000,601
- Issue date Apr 7, 2015
- Hitachi Power Semiconductor Device, Ltd.
- Katsunori Azuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module and manufacturing method thereof
- Patent number 8,723,320
- Issue date May 13, 2014
- Hitachi, Ltd.
- Isamu Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor power module, inverter/converter including the same,...
- Patent number 8,564,953
- Issue date Oct 22, 2013
- Hitachi, Ltd.
- Keisuke Horiuchi
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Power module and vehicle-mounted inverter using the same
- Patent number 8,519,561
- Issue date Aug 27, 2013
- Hitachi, Ltd.
- Katsunori Azuma
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor power module, inverter, and method of manufacturing a...
- Patent number 8,472,188
- Issue date Jun 25, 2013
- Hitachi, Ltd.
- Keisuke Horiuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Portion of power module for power inverter
- Patent number D598846
- Issue date Aug 25, 2009
- Hitachi, Ltd.
- Toshiya Satoh
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Hermetically sealed semiconductor power module and large scale modu...
- Patent number 6,967,402
- Issue date Nov 22, 2005
- Kabushiki Kaisha Toshiba
- Michiaki Hiyoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Voltage-driven power semiconductor device
- Patent number 6,967,357
- Issue date Nov 22, 2005
- Kabushiki Kaisha Toshiba
- Hironobu Kon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including intermediate wiring element
- Patent number 6,770,964
- Issue date Aug 3, 2004
- Kabushiki Kaisha Toshiba
- Michiaki Hiyoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having junction-termination structure of resur...
- Patent number 6,765,239
- Issue date Jul 20, 2004
- Kabushiki Kaisha Toshiba
- Michiaki Hiyoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetically sealed semiconductor power module and large scale modu...
- Patent number 6,756,667
- Issue date Jun 29, 2004
- Kabushiki Kaisha Toshiba
- Michiaki Hiyoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetically sealed semiconductor power module and large scale modu...
- Patent number 6,297,549
- Issue date Oct 2, 2001
- Kabushiki Kaisha Toshiba
- Michiaki Hiyoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Voltage-driven power semiconductor device
- Patent number 6,147,368
- Issue date Nov 14, 2000
- Kabushiki Kaisha Toshiba
- Hironobu Kon
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Multichip press-contact type semiconductor device
- Patent number 5,990,501
- Issue date Nov 23, 1999
- Kabushiki Kaisha Toshiba
- Michiaki Hiyoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure-contact type semiconductor device
- Patent number 5,874,750
- Issue date Feb 23, 1999
- Kabushiki Kaisha Toshiba
- Satoshi Yanagisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip press-contact type semiconductor device
- Patent number 5,866,944
- Issue date Feb 2, 1999
- Kabushiki Kaisha Toshiba
- Michiaki Hiyoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reverse conducting gate-turnoff thyristor
- Patent number 5,835,985
- Issue date Nov 10, 1998
- Kabushiki Kaisha Toshiba
- Michiaki Hiyoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Internal compression bonded semiconductor device with a chip frame...
- Patent number 5,760,425
- Issue date Jun 2, 1998
- Kabushiki Kaisha Tobshiba
- Ikuko Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip press-contact type semiconductor device
- Patent number 5,708,299
- Issue date Jan 13, 1998
- Kabushiki Kaisha Toshiba
- Satoshi Teramae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Press-contact type semiconductor devices
- Patent number 5,610,439
- Issue date Mar 11, 1997
- Kabushiki Kaisha Toshiba
- Michiaki Hiyoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Press-contact type semiconductor device
- Patent number 5,360,985
- Issue date Nov 1, 1994
- Kabushiki Kaisha Toshiba
- Michiaki Hiyoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Crimp-type power semiconductor device
- Patent number 5,198,882
- Issue date Mar 30, 1993
- Kabushiki Kaisha Toshiba
- Hideo Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Crimp-type semiconductor device having non-alloy structure
- Patent number 5,140,406
- Issue date Aug 18, 1992
- Kabushiki Kaisha Toshiba
- Hideo Matsuda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device And A Method Of Manufacturing Same
- Publication number 20130313711
- Publication date Nov 28, 2013
- Hitachi, Ltd
- Yukihiro KUMAGAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Module and Manufacturing Method Thereof
- Publication number 20130049201
- Publication date Feb 28, 2013
- Hitachi, Ltd
- Isamu YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE
- Publication number 20130001805
- Publication date Jan 3, 2013
- Katsunori AZUMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Power Module, Inverter/Converter Including the same,...
- Publication number 20110188204
- Publication date Aug 4, 2011
- Hitachi, Ltd
- Keisuke HORIUCHI
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Power Module and Vehicle-Mounted Inverter Using the Same
- Publication number 20100327654
- Publication date Dec 30, 2010
- Hitachi, Ltd
- Katsunori AZUMA
- B60 - VEHICLES IN GENERAL
Information Patent Application
SEMICONDUCTOR POWER MODULE, INVERTER, AND METHOD OF MANUFACTURING A...
- Publication number 20100208427
- Publication date Aug 19, 2010
- Hitachi, Ltd.
- Keisuke Horiuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Hermetically sealed semiconductor power module and large scale modu...
- Publication number 20040159940
- Publication date Aug 19, 2004
- KABUSHIKI KAISHA TOSHIBA
- Michiaki Hiyoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pressure-contact type semiconductor device
- Publication number 20040021149
- Publication date Feb 5, 2004
- Kabushiki Kaisha Toshiba
- Hideaki Kitazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hermetically sealed semiconductor power module and large scale modu...
- Publication number 20020027283
- Publication date Mar 7, 2002
- Kabushiki Kaisha Toshiba
- Michiaki Hiyoshi
- H01 - BASIC ELECTRIC ELEMENTS

Michiaki Hiyoshi

Person

Patents Grantslast 30 patents

Semiconductor device and a method of manufacturing same

Power semiconductor module

Power module and manufacturing method thereof

Semiconductor power module, inverter/converter including the same,...

Power module and vehicle-mounted inverter using the same

Semiconductor power module, inverter, and method of manufacturing a...

Portion of power module for power inverter

Hermetically sealed semiconductor power module and large scale modu...

Voltage-driven power semiconductor device

Semiconductor device including intermediate wiring element

Semiconductor device having junction-termination structure of resur...

Hermetically sealed semiconductor power module and large scale modu...

Hermetically sealed semiconductor power module and large scale modu...

Voltage-driven power semiconductor device

Multichip press-contact type semiconductor device

Pressure-contact type semiconductor device

Multichip press-contact type semiconductor device

Reverse conducting gate-turnoff thyristor

Internal compression bonded semiconductor device with a chip frame...

Multichip press-contact type semiconductor device

Press-contact type semiconductor devices

Press-contact type semiconductor device

Crimp-type power semiconductor device

Crimp-type semiconductor device having non-alloy structure

Patents Applicationslast 30 patents

Semiconductor Device And A Method Of Manufacturing Same

Power Module and Manufacturing Method Thereof

POWER SEMICONDUCTOR MODULE

Semiconductor Power Module, Inverter/Converter Including the same,...

Power Module and Vehicle-Mounted Inverter Using the Same

SEMICONDUCTOR POWER MODULE, INVERTER, AND METHOD OF MANUFACTURING A...

Hermetically sealed semiconductor power module and large scale modu...

Pressure-contact type semiconductor device

Hermetically sealed semiconductor power module and large scale modu...