Michiel Van Soestbergen

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Wageningen, NL

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Patents Grantslast 30 patents

Information Patent Grant
Degradation monitor for bond wire to bond pad interfaces
- Patent number 12,061,228
- Issue date Aug 13, 2024
- NXP B.V.
- Michiel van Soestbergen
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for improved circuit structure thermal reliabi...
- Patent number 11,508,669
- Issue date Nov 22, 2022
- NXP B.V.
- Leo van Gemert
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Underbump metallization dimension variation with improved reliability
- Patent number 10,825,789
- Issue date Nov 3, 2020
- NXP B.V.
- Leo Van Gemert
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DEGRADATION MONITOR FOR BOND WIRE TO BOND PAD INTERFACES
- Publication number 20230393192
- Publication date Dec 7, 2023
- NXP B.V.
- Michiel van Soestbergen
- G01 - MEASURING TESTING
Information Patent Application
Method and Apparatus for improved Circuit Structure Thermal Reliabi...
- Publication number 20210066209
- Publication date Mar 4, 2021
- NXP B.V.
- Leo van Gemert
- G06 - COMPUTING CALCULATING COUNTING