Michihiko Yanagisawa

Person

Ayase-shi, Kanagawa-ken, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Local dry etching method
- Patent number 7,094,355
- Issue date Aug 22, 2006
- SPEEDFAM Co., Ltd.
- Michihiko Yanagisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer table for local dry etching apparatus
- Patent number 7,005,032
- Issue date Feb 28, 2006
- Speedfam Co., Ltd
- Michihiko Yanagisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Local dry etching method
- Patent number 6,908,566
- Issue date Jun 21, 2005
- SPEEDFAM Co., Ltd.
- Michihiko Yanagisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanotopography removing method
- Patent number 6,875,701
- Issue date Apr 5, 2005
- Speedfam Co., Ltd
- Michihiko Yanagisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Local dry etching method
- Patent number 6,649,528
- Issue date Nov 18, 2003
- Speedfam Co., Ltd.
- Michihiko Yanagisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer flattening process and storage medium
- Patent number 6,496,748
- Issue date Dec 17, 2002
- SpeedFam Co., Ltd.
- Michihiko Yanagisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer etching method
- Patent number 6,451,217
- Issue date Sep 17, 2002
- SpeedFam-IPEC Co., Ltd.
- Michihiko Yanagisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor wafer
- Patent number 6,432,824
- Issue date Aug 13, 2002
- SPEEDFAM Co., Ltd.
- Michihiko Yanagisawa
- C30 - CRYSTAL GROWTH
Information Patent Grant
Discharge tube for a local etching apparatus and a local etching ap...
- Patent number 6,429,399
- Issue date Aug 6, 2002
- SPEEDFAM Co., Ltd.
- Michihiko Yanagisawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Processing apparatus for etching the edge of a silicon wafer
- Patent number 6,406,589
- Issue date Jun 18, 2002
- Speedfam-Ipec Co LTD
- Michihiko Yanagisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer flattening system
- Patent number 6,360,687
- Issue date Mar 26, 2002
- SpeedFam-IPEC Co., Ltd.
- Michihiko Yanagisawa
- B24 - GRINDING POLISHING
Information Patent Grant
Corrosion-resistant system and method for a plasma etching apparatus
- Patent number 6,316,369
- Issue date Nov 13, 2001
- Speedfam Co., Ltd
- Michihiko Yanagisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma etching apparatus
- Patent number 6,306,245
- Issue date Oct 23, 2001
- Michihiko Yanagisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Local etching apparatus
- Patent number 6,302,995
- Issue date Oct 16, 2001
- SpeedFam-IPEC Co., Ltd.
- Chikai Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer flattening process
- Patent number 6,303,511
- Issue date Oct 16, 2001
- SpeedFam-IPEC Co., Ltd.
- Michihiko Yanagisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer flattening process and system
- Patent number 6,280,645
- Issue date Aug 28, 2001
- Yasuhiro Horiike and SpeedFam Co, Ltd.
- Michihiko Yanagisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Combined CMP and plasma etching wafer flattening system
- Patent number 6,254,718
- Issue date Jul 3, 2001
- SpeedFam Co., Ltd.
- Chikai Tanaka
- B24 - GRINDING POLISHING
Information Patent Grant
Plasma etching method and plasma etching system for carrying out th...
- Patent number 6,159,388
- Issue date Dec 12, 2000
- Speedfam Co., Ltd.
- Michihiko Yanagisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma etching method
- Patent number 5,980,769
- Issue date Nov 9, 1999
- Speedfam Co., Ltd.
- Michihiko Yanagisawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Local dry etching method
- Publication number 20040142571
- Publication date Jul 22, 2004
- SPEEDFAM Co., Ltd.
- Michihiko Yanagisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-step local dry etching method for SOI wafer
- Publication number 20040063329
- Publication date Apr 1, 2004
- SPEEDFAM Co., Ltd.
- Michihiko Yanagisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Local dry etching method
- Publication number 20030199168
- Publication date Oct 23, 2003
- SPEEDFAM Co., Ltd.
- Michihiko Yanagisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Local dry etching method
- Publication number 20020173149
- Publication date Nov 21, 2002
- SPEEDFAM Co., Ltd.
- Michihiko Yanagisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Local etching method
- Publication number 20020144781
- Publication date Oct 10, 2002
- Michihiko Yanagisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer table for local dry etching apparatus
- Publication number 20020139482
- Publication date Oct 3, 2002
- Michihiko Yanagisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Nanotopography removing method
- Publication number 20020104825
- Publication date Aug 8, 2002
- Michihiko Yanagisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Local etching apparatus and local etching method
- Publication number 20020008082
- Publication date Jan 24, 2002
- SpeedFam Co., Ltd.
- Chikai Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Local etching apparatus and local etching method
- Publication number 20010036741
- Publication date Nov 1, 2001
- Chikai Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCAL ETCHING APPARATUS AND LOCAL ETCHING METHOD
- Publication number 20010032705
- Publication date Oct 25, 2001
- TAKESHI SADOHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Discharge tube for a local etching apparatus and a local etching ap...
- Publication number 20010019040
- Publication date Sep 6, 2001
- Michihiko Yanagisawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for manufacturing a semiconductor wafer
- Publication number 20010018271
- Publication date Aug 30, 2001
- Michihiko Yanagisawa
- C30 - CRYSTAL GROWTH
Information Patent Application
Wafer flattening process and system
- Publication number 20010007275
- Publication date Jul 12, 2001
- SpeedFam Co., Ltd.
- Michihiko Yanagisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER FLATTENING PROCESS
- Publication number 20010002336
- Publication date May 31, 2001
- MICHIHIKO YANAGISAWA
- H01 - BASIC ELECTRIC ELEMENTS

Michihiko Yanagisawa

Person

Patents Grantslast 30 patents

Local dry etching method

Wafer table for local dry etching apparatus

Local dry etching method

Nanotopography removing method

Local dry etching method

Wafer flattening process and storage medium

Wafer etching method

Method for manufacturing a semiconductor wafer

Discharge tube for a local etching apparatus and a local etching ap...

Processing apparatus for etching the edge of a silicon wafer

Wafer flattening system

Corrosion-resistant system and method for a plasma etching apparatus

Plasma etching apparatus

Local etching apparatus

Wafer flattening process

Wafer flattening process and system

Combined CMP and plasma etching wafer flattening system

Plasma etching method and plasma etching system for carrying out th...

Plasma etching method

Patents Applicationslast 30 patents

Local dry etching method

Multi-step local dry etching method for SOI wafer

Local dry etching method

Local dry etching method

Local etching method

Wafer table for local dry etching apparatus

Nanotopography removing method

Local etching apparatus and local etching method

Local etching apparatus and local etching method

LOCAL ETCHING APPARATUS AND LOCAL ETCHING METHOD

Discharge tube for a local etching apparatus and a local etching ap...

Method for manufacturing a semiconductor wafer

Wafer flattening process and system

WAFER FLATTENING PROCESS