Michihiro SUGO

Person

Takasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Detergent composition, substrate cleaning method, and cleaning meth...
- Patent number 12,168,759
- Issue date Dec 17, 2024
- Shin-Etsu Chemical Co., Ltd.
- Masahito Tanabe
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Cleaning solution for temporary adhesive for substrates, substrate...
- Patent number 12,129,455
- Issue date Oct 29, 2024
- Shin-Etsu Chemical Co., Ltd.
- Michihiro Sugo
- B08 - CLEANING
Information Patent Grant
Photosensitive resin composition, laminate, and pattern forming pro...
- Patent number 12,055,853
- Issue date Aug 6, 2024
- Shin-Etsu Chemical Co., Ltd.
- Kumiko Hayashi
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Temporary adhesive for wafer processing, wafer laminate and method...
- Patent number 11,970,639
- Issue date Apr 30, 2024
- Shin-Etsu Chemical Co., Ltd.
- Mitsuo Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photosensitive resin composition, photosensitive dry film, and patt...
- Patent number 11,460,774
- Issue date Oct 4, 2022
- Shin-Etsu Chemical Co., Ltd.
- Yoshinori Hirano
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Photosensitive resin composition, photosensitive dry film, and patt...
- Patent number 11,262,655
- Issue date Mar 1, 2022
- Shin-Etsu Chemical Co., Ltd.
- Hitoshi Maruyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing laminate and method for manufacturing subs...
- Patent number 11,183,417
- Issue date Nov 23, 2021
- Shin-Etsu Chemical Co., Ltd.
- Masahito Tanabe
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for producing thin wafer
- Patent number 11,069,557
- Issue date Jul 20, 2021
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Yasuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing laminate and method for processing wafer
- Patent number 10,991,611
- Issue date Apr 27, 2021
- Shin-Etsu Chemical Co., Ltd.
- Shohei Tagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymer containing silphenylene and polyether structures
- Patent number 10,982,053
- Issue date Apr 20, 2021
- Shin-Etsu Chemical Co., Ltd.
- Hitoshi Maruyama
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method for manufacturing thin substrate
- Patent number 10,950,481
- Issue date Mar 16, 2021
- Shin-Etsu Chemical Co., Ltd.
- Masahito Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit substrate processing laminate and method for processing cir...
- Patent number 10,854,496
- Issue date Dec 1, 2020
- Shin-Etsu Chemical Co., Ltd.
- Shohei Tagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temporary adhesive film roll for substrate processing, method for m...
- Patent number 10,796,939
- Issue date Oct 6, 2020
- Shin-Etsu Chemical Co., Ltd.
- Masahito Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method for producing the same, and laminate
- Patent number 10,727,103
- Issue date Jul 28, 2020
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Yasuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer laminate, method for production thereof, and adhesive composi...
- Patent number 10,658,314
- Issue date May 19, 2020
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Yasuda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Wafer laminate and method of producing the same
- Patent number 10,553,552
- Issue date Feb 4, 2020
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Yasuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer laminate and making method
- Patent number 10,453,732
- Issue date Oct 22, 2019
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Yasuda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Silicone skeleton-containing polymer, photo-curable resin compositi...
- Patent number 10,451,970
- Issue date Oct 22, 2019
- Shin-Etsu Chemical Co., Ltd.
- Hitoshi Maruyama
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Laminate and making method
- Patent number 10,373,903
- Issue date Aug 6, 2019
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Yasuda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor apparatus, stacked semiconductor apparatus, encapsula...
- Patent number 10,319,653
- Issue date Jun 11, 2019
- Shin-Etsu Chemical Co., Ltd.
- Katsuya Takemura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition, resin film, method for producing resin film, met...
- Patent number 10,308,787
- Issue date Jun 4, 2019
- Shin-Etsu Chemical Co., Ltd.
- Kazunori Kondo
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor device, making method, and laminate
- Patent number 10,297,485
- Issue date May 21, 2019
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Yasuda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Wafer processing laminate, temporary adhesive material for wafer pr...
- Patent number 10,242,902
- Issue date Mar 26, 2019
- Shin-Etsu Chemical Co., Ltd.
- Michihiro Sugo
- B32 - LAYERED PRODUCTS
Information Patent Grant
Wafer processing laminate, temporary adhesive material for wafer pr...
- Patent number 10,147,632
- Issue date Dec 4, 2018
- Shin-Etsu Chemical Co., Ltd.
- Shohei Tagami
- B32 - LAYERED PRODUCTS
Information Patent Grant
Semiconductor apparatus, stacked semiconductor apparatus and encaps...
- Patent number 10,141,272
- Issue date Nov 27, 2018
- Shin-Etsu Chemical Co., Ltd.
- Katsuya Takemura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wafer processing laminate, temporary adhesive material for wafer pr...
- Patent number 10,128,143
- Issue date Nov 13, 2018
- Shin-Etsu Chemical Co., Ltd.
- Masahito Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing laminate and method for processing wafer
- Patent number 10,115,622
- Issue date Oct 30, 2018
- Shin-Etsu Chemical Co., Ltd.
- Shohei Tagami
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Wafer processing laminate, temporary adhesive material for wafer pr...
- Patent number 10,106,713
- Issue date Oct 23, 2018
- Shin-Etsu Chemical Co., Ltd.
- Shohei Tagami
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Wafer laminate and making method
- Patent number 10,074,626
- Issue date Sep 11, 2018
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Yasuda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Wafer processing temporary bonding arrangement, wafer processing la...
- Patent number 9,941,145
- Issue date Apr 10, 2018
- Shin-Etsu Chemical Co., Ltd.
- Masahito Tanabe
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TEMPORARY ADHESIVE FOR WAFER PROCESSING, WAFER LAMINATE AND METHOD...
- Publication number 20230088354
- Publication date Mar 23, 2023
- Shin-Etsu Chemical Co., Ltd.
- Mitsuo Muto
- B32 - LAYERED PRODUCTS
Information Patent Application
WAFER PROCESSING TEMPORARY ADHESIVE, WAFER LAMINATE, THIN WAFER MAN...
- Publication number 20230002647
- Publication date Jan 5, 2023
- Shin-Etsu Chemical Co., Ltd.
- Mitsuo Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPORARY ADHESIVE MATERIAL FOR SUBSTRATE PROCESSING AND METHOD FOR...
- Publication number 20220372353
- Publication date Nov 24, 2022
- Shin-Etsu Chemical Co., Ltd.
- Masahito TANABE
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
WAFER PROCESSING LAMINATE, TEMPORARY ADHESIVE MATERIAL FOR WAFER PR...
- Publication number 20220352001
- Publication date Nov 3, 2022
- Shin-Etsu Chemical Co., Ltd.
- Mitsuo MUTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLEANING SOLUTION FOR TEMPORARY ADHESIVE FOR SUBSTRATES, SUBSTRATE...
- Publication number 20220195352
- Publication date Jun 23, 2022
- Shin-Etsu Chemical Co., Ltd.
- Michihiro SUGO
- B08 - CLEANING
Information Patent Application
DETERGENT COMPOSITION, SUBSTRATE CLEANING METHOD, AND CLEANING METH...
- Publication number 20220186152
- Publication date Jun 16, 2022
- Shin-Etsu Chemical Co., Ltd.
- Masahito TANABE
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, LAMINATE, AND PATTERN FORMING PRO...
- Publication number 20200209751
- Publication date Jul 2, 2020
- Shin-Etsu Chemical Co., Ltd.
- Kumiko Hayashi
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM, AND PATT...
- Publication number 20200201182
- Publication date Jun 25, 2020
- Shin-Etsu Chemical Co., Ltd.
- Yoshinori Hirano
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD FOR MANUFACTURING LAMINATE AND METHOD FOR MANUFACTURING SUBS...
- Publication number 20200144093
- Publication date May 7, 2020
- Shin-Etsu Chemical Co., Ltd.
- Masahito TANABE
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR PRODUCING THIN WAFER
- Publication number 20200075388
- Publication date Mar 5, 2020
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Yasuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING THIN SUBSTRATE
- Publication number 20190371644
- Publication date Dec 5, 2019
- Shin-Etsu Chemical Co., Ltd.
- Masahito TANABE
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
POLYMER CONTAINING SILPHENYLENE AND POLYETHER STRUCTURES
- Publication number 20190352465
- Publication date Nov 21, 2019
- Shin-Etsu Chemical Co., Ltd.
- Hitoshi Maruyama
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM, AND PATT...
- Publication number 20190354014
- Publication date Nov 21, 2019
- Shin-Etsu Chemical Co., Ltd.
- Hitoshi Maruyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT SUBSTRATE PROCESSING LAMINATE AND METHOD FOR PROCESSING CIR...
- Publication number 20190318952
- Publication date Oct 17, 2019
- Shin-Etsu Chemical Co., Ltd.
- Shohei TAGAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD FOR PRODUCING THE SAME, AND LAMINATE
- Publication number 20190103299
- Publication date Apr 4, 2019
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Yasuda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
WAFER PROCESSING LAMINATE AND METHOD FOR PROCESSING WAFER
- Publication number 20190027391
- Publication date Jan 24, 2019
- Shin-Etsu Chemical Co., Ltd.
- Shohei TAGAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPORARY ADHESIVE FILM ROLL FOR SUBSTRATE PROCESSING, METHOD FOR M...
- Publication number 20180350650
- Publication date Dec 6, 2018
- Shin-Etsu Chemical Co., Ltd.
- Masahito TANABE
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR DEVICE, MAKING METHOD, AND LAMINATE
- Publication number 20180277415
- Publication date Sep 27, 2018
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Yasuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATE AND MAKING METHOD
- Publication number 20180277472
- Publication date Sep 27, 2018
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Yasuda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
WAFER LAMINATE, METHOD FOR PRODUCTION THEREOF, AND ADHESIVE COMPOSI...
- Publication number 20180102333
- Publication date Apr 12, 2018
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Yasuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LAMINATE AND METHOD OF PRODUCING THE SAME
- Publication number 20180102334
- Publication date Apr 12, 2018
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Yasuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICONE SKELETON-CONTAINING POLYMER, PHOTO-CURABLE RESIN COMPOSITI...
- Publication number 20180004088
- Publication date Jan 4, 2018
- Shin-Etsu Chemical Co., Ltd.
- Hitoshi MARUYAMA
- B32 - LAYERED PRODUCTS
Information Patent Application
WAFER LAMINATE AND MAKING METHOD
- Publication number 20170352637
- Publication date Dec 7, 2017
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Yasuda
- B32 - LAYERED PRODUCTS
Information Patent Application
WAFER PROCESSING LAMINATE, METHOD FOR MANUFACTURING THEREOF, AND ME...
- Publication number 20170330803
- Publication date Nov 16, 2017
- Shin-Etsu Chemical Co., Ltd.
- Shohei TAGAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION, RESIN FILM, METHOD FOR PRODUCING RESIN FILM, MET...
- Publication number 20170283581
- Publication date Oct 5, 2017
- Shin-Etsu Chemical Co., Ltd.
- Kazunori KONDO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
WAFER LAMINATE AND MAKING METHOD
- Publication number 20170154802
- Publication date Jun 1, 2017
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Yasuda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
WAFER PROCESSING LAMINATE AND METHOD FOR PROCESSING WAFER
- Publication number 20170154801
- Publication date Jun 1, 2017
- Shin-Etsu Chemical Co., Ltd.
- Shohei TAGAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING LAMINATE, TEMPORARY ADHESIVE MATERIAL FOR WAFER PR...
- Publication number 20170110360
- Publication date Apr 20, 2017
- Shin-Etsu Chemical Co., Ltd.
- Shohei TAGAMI
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR APPARATUS, STACKED SEMICONDUCTOR APPARATUS, ENCAPSULA...
- Publication number 20170103932
- Publication date Apr 13, 2017
- Shin-Etsu Chemical Co., Ltd.
- Katsuya TAKEMURA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TEMPORARY ADHESION METHOD AND METHOD FOR PRODUCING THIN WAFER
- Publication number 20170101555
- Publication date Apr 13, 2017
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki YASUDA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Michihiro SUGO

Person

Patents Grantslast 30 patents

Detergent composition, substrate cleaning method, and cleaning meth...

Cleaning solution for temporary adhesive for substrates, substrate...

Photosensitive resin composition, laminate, and pattern forming pro...

Temporary adhesive for wafer processing, wafer laminate and method...

Photosensitive resin composition, photosensitive dry film, and patt...

Photosensitive resin composition, photosensitive dry film, and patt...

Method for manufacturing laminate and method for manufacturing subs...

Method for producing thin wafer

Wafer processing laminate and method for processing wafer

Polymer containing silphenylene and polyether structures

Method for manufacturing thin substrate

Circuit substrate processing laminate and method for processing cir...

Temporary adhesive film roll for substrate processing, method for m...

Semiconductor device, method for producing the same, and laminate

Wafer laminate, method for production thereof, and adhesive composi...

Wafer laminate and method of producing the same

Wafer laminate and making method

Silicone skeleton-containing polymer, photo-curable resin compositi...

Laminate and making method

Semiconductor apparatus, stacked semiconductor apparatus, encapsula...

Resin composition, resin film, method for producing resin film, met...

Semiconductor device, making method, and laminate

Wafer processing laminate, temporary adhesive material for wafer pr...

Wafer processing laminate, temporary adhesive material for wafer pr...

Semiconductor apparatus, stacked semiconductor apparatus and encaps...

Wafer processing laminate, temporary adhesive material for wafer pr...

Wafer processing laminate and method for processing wafer

Wafer processing laminate, temporary adhesive material for wafer pr...

Wafer laminate and making method

Wafer processing temporary bonding arrangement, wafer processing la...

Patents Applicationslast 30 patents

TEMPORARY ADHESIVE FOR WAFER PROCESSING, WAFER LAMINATE AND METHOD...

WAFER PROCESSING TEMPORARY ADHESIVE, WAFER LAMINATE, THIN WAFER MAN...

TEMPORARY ADHESIVE MATERIAL FOR SUBSTRATE PROCESSING AND METHOD FOR...

WAFER PROCESSING LAMINATE, TEMPORARY ADHESIVE MATERIAL FOR WAFER PR...

CLEANING SOLUTION FOR TEMPORARY ADHESIVE FOR SUBSTRATES, SUBSTRATE...

DETERGENT COMPOSITION, SUBSTRATE CLEANING METHOD, AND CLEANING METH...

PHOTOSENSITIVE RESIN COMPOSITION, LAMINATE, AND PATTERN FORMING PRO...

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM, AND PATT...

METHOD FOR MANUFACTURING LAMINATE AND METHOD FOR MANUFACTURING SUBS...

METHOD FOR PRODUCING THIN WAFER

METHOD FOR MANUFACTURING THIN SUBSTRATE

POLYMER CONTAINING SILPHENYLENE AND POLYETHER STRUCTURES

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM, AND PATT...

CIRCUIT SUBSTRATE PROCESSING LAMINATE AND METHOD FOR PROCESSING CIR...

SEMICONDUCTOR DEVICE, METHOD FOR PRODUCING THE SAME, AND LAMINATE

WAFER PROCESSING LAMINATE AND METHOD FOR PROCESSING WAFER

TEMPORARY ADHESIVE FILM ROLL FOR SUBSTRATE PROCESSING, METHOD FOR M...

SEMICONDUCTOR DEVICE, MAKING METHOD, AND LAMINATE

LAMINATE AND MAKING METHOD

WAFER LAMINATE, METHOD FOR PRODUCTION THEREOF, AND ADHESIVE COMPOSI...

WAFER LAMINATE AND METHOD OF PRODUCING THE SAME

SILICONE SKELETON-CONTAINING POLYMER, PHOTO-CURABLE RESIN COMPOSITI...

WAFER LAMINATE AND MAKING METHOD

WAFER PROCESSING LAMINATE, METHOD FOR MANUFACTURING THEREOF, AND ME...

RESIN COMPOSITION, RESIN FILM, METHOD FOR PRODUCING RESIN FILM, MET...

WAFER LAMINATE AND MAKING METHOD

WAFER PROCESSING LAMINATE AND METHOD FOR PROCESSING WAFER

WAFER PROCESSING LAMINATE, TEMPORARY ADHESIVE MATERIAL FOR WAFER PR...

SEMICONDUCTOR APPARATUS, STACKED SEMICONDUCTOR APPARATUS, ENCAPSULA...

TEMPORARY ADHESION METHOD AND METHOD FOR PRODUCING THIN WAFER