Michihiro Takata

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Toyama, JP

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Patents Grantslast 30 patents

Information Patent Grant
Apparatus and method of chamfering wafer
- Patent number 6,439,969
- Issue date Aug 27, 2002
- Nippei Toyama Corporation
- Kikuo Koma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for grinding a workpiece
- Patent number 6,332,834
- Issue date Dec 25, 2001
- Nippei Toyama Corporation
- Mitsuru Nukui
- B24 - GRINDING POLISHING