Michimoto Kaminaga

Person

Yokkaichi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor die including edge ring structures and methods for ma...
- Patent number 11,342,286
- Issue date May 24, 2022
- SanDisk Technologies LLC
- Michimoto Kaminaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die including edge ring structures and methods for ma...
- Patent number 11,289,388
- Issue date Mar 29, 2022
- SanDisk Technologies LLC
- Takahiro Tanamachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing through-memory-level con...
- Patent number 11,049,876
- Issue date Jun 29, 2021
- SanDisk Technologies LLC
- Michimoto Kaminaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing through-memory-level con...
- Patent number 10,971,507
- Issue date Apr 6, 2021
- SanDisk Technologies LLC
- Michimoto Kaminaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing through-memory-level con...
- Patent number 10,903,230
- Issue date Jan 26, 2021
- SanDisk Technologies LLC
- Michimoto Kaminaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing through-memory-level con...
- Patent number 10,727,248
- Issue date Jul 28, 2020
- SanDisk Technologies LLC
- Michimoto Kaminaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing different pedestal width...
- Patent number 10,269,820
- Issue date Apr 23, 2019
- SanDisk Technologies LLC
- Michimoto Kaminaga
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DIE INCLUDING EDGE RING STRUCTURES AND METHODS FOR MA...
- Publication number 20210313240
- Publication date Oct 7, 2021
- SANDISK TECHNOLOGIES LLC
- Takahiro TANAMACHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE INCLUDING EDGE RING STRUCTURES AND METHODS FOR MA...
- Publication number 20210313281
- Publication date Oct 7, 2021
- SANDISK TECHNOLOGIES LLC
- Michimoto KAMINAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING THROUGH-MEMORY-LEVEL CON...
- Publication number 20200286917
- Publication date Sep 10, 2020
- SANDISK TECHNOLOGIES LLC
- Michimoto KAMINAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING THROUGH-MEMORY-LEVEL CON...
- Publication number 20200035694
- Publication date Jan 30, 2020
- SANDISK TECHNOLOGIES LLC
- Michimoto KAMINAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING THROUGH-MEMORY-LEVEL CON...
- Publication number 20190252403
- Publication date Aug 15, 2019
- SANDISK TECHNOLOGIES LLC
- Michimoto KAMINAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING THROUGH-MEMORY-LEVEL CON...
- Publication number 20190252404
- Publication date Aug 15, 2019
- SANDISK TECHNOLOGIES LLC
- Michimoto Kaminaga
- H01 - BASIC ELECTRIC ELEMENTS

Michimoto Kaminaga

Person

Patents Grantslast 30 patents

Semiconductor die including edge ring structures and methods for ma...

Semiconductor die including edge ring structures and methods for ma...

Three-dimensional memory device containing through-memory-level con...

Three-dimensional memory device containing through-memory-level con...

Three-dimensional memory device containing through-memory-level con...

Three-dimensional memory device containing through-memory-level con...

Three-dimensional memory device containing different pedestal width...

Patents Applicationslast 30 patents

SEMICONDUCTOR DIE INCLUDING EDGE RING STRUCTURES AND METHODS FOR MA...

SEMICONDUCTOR DIE INCLUDING EDGE RING STRUCTURES AND METHODS FOR MA...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING THROUGH-MEMORY-LEVEL CON...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING THROUGH-MEMORY-LEVEL CON...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING THROUGH-MEMORY-LEVEL CON...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING THROUGH-MEMORY-LEVEL CON...