Michio Asahina

Person

Suwa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor devices including an alloy layer and a wetting layer...
- Patent number 7,091,609
- Issue date Aug 15, 2006
- Seiko Epson Corporation
- Kazuki Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods for manufacturing the same
- Patent number 6,812,123
- Issue date Nov 2, 2004
- Seiko Epson Corporation
- Kazuki Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming bonding pad structures in semiconductor devices
- Patent number 6,723,628
- Issue date Apr 20, 2004
- Seiko Epson Corporation
- Kazuki Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 6,614,119
- Issue date Sep 2, 2003
- Seiko Epson Corporation
- Michio Asahina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor devices
- Patent number 6,511,910
- Issue date Jan 28, 2003
- Seiko Epson Corporation
- Michio Asahina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a contact structure using aluminum
- Patent number 6,486,555
- Issue date Nov 26, 2002
- Seiko Epson Corporation
- Michio Asahina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor devices with allevration of...
- Patent number 6,458,703
- Issue date Oct 1, 2002
- Seiko Epson Corporation
- Mamoru Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 6,429,493
- Issue date Aug 6, 2002
- Seiko Epson Corporation
- Michio Asahina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor devices
- Patent number 6,350,685
- Issue date Feb 26, 2002
- Seiko Epson Corporation
- Michio Asahina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 6,326,287
- Issue date Dec 4, 2001
- Seiko Epson Corporation
- Michio Asahina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 6,194,304
- Issue date Feb 27, 2001
- Seiko Epson Corporation
- Yukio Morozumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 6,144,097
- Issue date Nov 7, 2000
- Seiko Epson Corporation
- Michio Asahina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 6,137,176
- Issue date Oct 24, 2000
- Seiko Epson Corporation
- Yukio Morozumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 6,107,182
- Issue date Aug 22, 2000
- Seiko Epson Corporation
- Michio Asahina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a semiconductor device having a conductor st...
- Patent number 5,342,806
- Issue date Aug 30, 1994
- Seiko Epson Corporation
- Michio Asahina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of production
- Patent number 5,190,886
- Issue date Mar 2, 1993
- Seiko Epson Corporation
- Michio Asahina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of production
- Patent number 5,093,276
- Issue date Mar 3, 1992
- Seiko Epson Corporation
- Michio Asahina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of production
- Patent number 5,086,006
- Issue date Feb 4, 1992
- Seiko Epson Corporation
- Michio Asahina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of production
- Patent number 4,985,746
- Issue date Jan 15, 1991
- Seiko Epson Corporation
- Michio Asahina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of preparation
- Patent number 4,826,781
- Issue date May 2, 1989
- Seiko Epson Corporation
- Michio Asahina
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor devices and methods for manufacturing the same
- Publication number 20040169274
- Publication date Sep 2, 2004
- Kazuki Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of fabricating the same
- Publication number 20040048460
- Publication date Mar 11, 2004
- SEIKO EPSON CORPORATION
- Michio Asahina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for manufacturing semiconductor dev...
- Publication number 20020180043
- Publication date Dec 5, 2002
- Seiko Epson Corporation
- Michio Asahina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A CONTACT STRUTURE USING ALUMINUM
- Publication number 20020014696
- Publication date Feb 7, 2002
- MICHIO ASAHINA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor devices and methods for manufacturing the same
- Publication number 20010051422
- Publication date Dec 13, 2001
- Kazuki Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEV...
- Publication number 20010041440
- Publication date Nov 15, 2001
- MAMORU ENDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor devices and methods for manufacturing the same
- Publication number 20010033028
- Publication date Oct 25, 2001
- Kazumi Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS

Michio Asahina

Person

Patents Grantslast 30 patents

Semiconductor devices including an alloy layer and a wetting layer...

Semiconductor devices and methods for manufacturing the same

Method for forming bonding pad structures in semiconductor devices

Semiconductor device and method of fabricating the same

Method for manufacturing semiconductor devices

Semiconductor device having a contact structure using aluminum

Method for manufacturing semiconductor devices with allevration of...

Semiconductor device and method for manufacturing semiconductor device

Method for manufacturing semiconductor devices

Semiconductor device and method of fabricating the same

Semiconductor device and method of fabricating the same

Semiconductor device and method of fabricating the same

Semiconductor device and method of fabricating the same

Semiconductor device and method of fabricating the same

Method for fabricating a semiconductor device having a conductor st...

Semiconductor device and method of production

Semiconductor device and method of production

Semiconductor device and method of production

Semiconductor device and method of production

Semiconductor device and method of preparation

Patents Applicationslast 30 patents

Semiconductor devices and methods for manufacturing the same

Semiconductor device and method of fabricating the same

Semiconductor device and method for manufacturing semiconductor dev...

SEMICONDUCTOR DEVICE HAVING A CONTACT STRUTURE USING ALUMINUM

Semiconductor devices and methods for manufacturing the same

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEV...

Semiconductor devices and methods for manufacturing the same