Michio Ishikawa

Person

  • Yokohama, JP

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    WAFER STAGE AND METHOD OF MANUFACTURING THE SAME

    • Publication number 20200152499
    • Publication date May 14, 2020
    • Samsung Electronics Co., Ltd.
    • KAZUYUKI TOMIZAWA
    • F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
  • Information Patent Application

    ELECTROSTATIC CHUCK AND WAFER ETCHING DEVICE INCLUDING THE SAME

    • Publication number 20200066565
    • Publication date Feb 27, 2020
    • Samsung Electronics Co., Ltd.
    • Myoung-soo Park
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FILM FORMING APPARATUS

    • Publication number 20190177841
    • Publication date Jun 13, 2019
    • Samsung Electronics Co., Ltd.
    • Kazuyuki TOMIZAWA
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    WAFER LOADING APPARATUS AND FILM FORMING APPARATUS

    • Publication number 20190177847
    • Publication date Jun 13, 2019
    • Samsung Electronics Co., Ltd.
    • Kazuyuki TOMIZAWA
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    Magnetic core for inductor

    • Publication number 20030020580
    • Publication date Jan 30, 2003
    • Pulsus Technologies Inc.
    • Bong Soo Jeong
    • H01 - BASIC ELECTRIC ELEMENTS