Michio KANAI

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Dicing sheet and a production method of a semiconductor chip
- Patent number 9,312,162
- Issue date Apr 12, 2016
- Lintec Corporation
- Yosuke Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultraviolet-curable pressure sensitive adhesive composition and ult...
- Patent number 6,605,345
- Issue date Aug 12, 2003
- Lintec Corporation
- Michio Kanai
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
Dicing Sheet and a Production Method of a Semiconductor Chip
- Publication number 20130133938
- Publication date May 30, 2013
- LINTEC CORPORATION
- Yosuke SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dicing Tape and Process for Manufacturing a Semiconductor Device
- Publication number 20100317173
- Publication date Dec 16, 2010
- LINTEC CORPORATION
- Michio Kanai
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Ultraviolet-curable pressure sensitive adhesive composition and ult...
- Publication number 20020019454
- Publication date Feb 14, 2002
- LINTEC CORPORATION
- Michio Kanai
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...