Michio Komoto

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Osaka, JP

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Patents Grantslast 30 patents

Information Patent Grant
Thermosetting resin composition for semiconductor devices
- Patent number 5,728,763
- Issue date Mar 17, 1998
- Nitto Denko Corporation
- Miho Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device
- Patent number 5,624,989
- Issue date Apr 29, 1997
- Nitto Denko Corporation
- Miho Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epoxy resin composition for semiconductor encapsulation and semicon...
- Patent number 5,294,835
- Issue date Mar 15, 1994
- Nitto Denko Corporation
- Kazumasa Igarashi
- H01 - BASIC ELECTRIC ELEMENTS