Michio Ono

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number RE35109
- Issue date Dec 5, 1995
- Fujitsu Limited
- Akihiro Kubota
- 257 - Active solid-state devices
Information Patent Grant
Semiconductor device and a method for fabricating the same
- Patent number 4,984,059
- Issue date Jan 8, 1991
- Fujitsu Limited
- Akihiro Kubota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin-molded semiconductor
- Patent number 4,903,114
- Issue date Feb 20, 1990
- Fujitsu Limited
- Tsuyoshi Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High packing density lead frame and integrated circuit
- Patent number 4,801,997
- Issue date Jan 31, 1989
- Fujitsu Limited
- Michio Ono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for integrated circuit
- Patent number 4,724,280
- Issue date Feb 9, 1988
- Fujitsu Limited
- Kazuto Tsuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin-molded semiconductor device
- Patent number 4,698,660
- Issue date Oct 6, 1987
- Fujitsu Limited
- Akihiro Kubota
- H01 - BASIC ELECTRIC ELEMENTS