Michio Osada

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Uji-shi, Kyoto-fu, JP

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Patents Grantslast 30 patents

Information Patent Grant
Lead frame for enclosing semiconductor chips with resin
- Patent number 4,862,586
- Issue date Sep 5, 1989
- Michio Osada
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Apparatus of multiplunger type for enclosing semiconductor elements...
- Patent number 4,793,785
- Issue date Dec 27, 1988
- Michio Osada
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Molding apparatus for enclosing semiconductor chips with resin
- Patent number 4,723,899
- Issue date Feb 9, 1988
- Michio Osada
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL