Michio Osada

Person

Kyoto, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing semiconductor resin molding and resin membe...
- Patent number 6,919,223
- Issue date Jul 19, 2005
- Towa Corporation
- Michio Osada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die used for resin-sealing and molding an electronic component
- Patent number 6,773,247
- Issue date Aug 10, 2004
- Towa Corporation
- Michio Osada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cutting apparatus and cutting method
- Patent number 6,736,703
- Issue date May 18, 2004
- Towa Corporation
- Michio Osada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Polishing apparatus and polishing method
- Patent number 6,712,674
- Issue date Mar 30, 2004
- Towa Corporation
- Makoto Matsuo
- B24 - GRINDING POLISHING
Information Patent Grant
Method for processing leadframe
- Patent number 6,594,889
- Issue date Jul 22, 2003
- Towa Corporation
- Kazuhiko Bandoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component, method of sealing electronic component with r...
- Patent number 6,438,826
- Issue date Aug 27, 2002
- Towa Corporation
- Shinji Takase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for processing resin sealed lead frame
- Patent number 6,258,628
- Issue date Jul 10, 2001
- Towa Corporation
- Michio Osada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of sealing electronic component with molded resin
- Patent number 5,874,324
- Issue date Feb 23, 1999
- Towa Corporation
- Michio Osada
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of and apparatus for molding resin to seal electronic parts
- Patent number 5,834,035
- Issue date Nov 10, 1998
- Towa Corporation
- Michio Osada
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Resin sealing and molding apparatus for sealing electronic parts
- Patent number 5,783,220
- Issue date Jul 21, 1998
- Towa Corporation
- Michio Osada
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of molding resin to seal electronic parts using two evacuati...
- Patent number 5,603,879
- Issue date Feb 18, 1997
- Towa Corporation
- Michio Osada
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Resin molding apparatus for sealing an electronic device
- Patent number 5,507,633
- Issue date Apr 16, 1996
- Towa Corporation
- Michio Osada
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of molding resin for sealing an electronic device
- Patent number 5,435,953
- Issue date Jul 25, 1995
- Towa Corporation
- Michio Osada
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for seal molding electronic components with resin
- Patent number 5,200,125
- Issue date Apr 6, 1993
- T&K International Laboratory, Ltd.
- Michio Osada
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Tape carrier used in tab system
- Patent number 5,153,708
- Issue date Oct 6, 1992
- Nippon Steel Corporation
- Naoharu Ohikata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film carrier for mounting IC chips
- Patent number 5,031,022
- Issue date Jul 9, 1991
- Nippon Steel Corporation
- Toshio Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method of manufacturing semiconductor resin molding and resin membe...
- Publication number 20030235938
- Publication date Dec 25, 2003
- TOWA CORPORATION
- Michio Osada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for evaluating degree of adhesion of adherents...
- Publication number 20030094185
- Publication date May 22, 2003
- TOWA CORPORATION
- Michio Osada
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Cutting apparatus and cutting method
- Publication number 20020160695
- Publication date Oct 31, 2002
- TOWA CORPORATION
- Michio Osada
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Polishing apparatus and polishing method
- Publication number 20020037685
- Publication date Mar 28, 2002
- TOWA CORPORATION
- Makoto Matsuo
- B24 - GRINDING POLISHING
Information Patent Application
Apparatus for processing resin sealed lead frame
- Publication number 20010021409
- Publication date Sep 13, 2001
- TOWA CORPORATION
- Michio Osada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic component, method of sealing electronic component with r...
- Publication number 20010013424
- Publication date Aug 16, 2001
- Shinji Takase
- H01 - BASIC ELECTRIC ELEMENTS

Michio Osada

Person

Patents Grantslast 30 patents

Method of manufacturing semiconductor resin molding and resin membe...

Die used for resin-sealing and molding an electronic component

Cutting apparatus and cutting method

Polishing apparatus and polishing method

Method for processing leadframe

Electronic component, method of sealing electronic component with r...

Method and apparatus for processing resin sealed lead frame

Method of sealing electronic component with molded resin

Method of and apparatus for molding resin to seal electronic parts

Resin sealing and molding apparatus for sealing electronic parts

Method of molding resin to seal electronic parts using two evacuati...

Resin molding apparatus for sealing an electronic device

Method of molding resin for sealing an electronic device

Method for seal molding electronic components with resin

Tape carrier used in tab system

Film carrier for mounting IC chips

Patents Applicationslast 30 patents

Method of manufacturing semiconductor resin molding and resin membe...

Apparatus and method for evaluating degree of adhesion of adherents...

Cutting apparatus and cutting method

Polishing apparatus and polishing method

Apparatus for processing resin sealed lead frame

Electronic component, method of sealing electronic component with r...